OMAP-L137

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低功耗 C674x 浮点 DSP + ARM9 处理器 - 高达 456MHz

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数据表

document-pdfAcrobat OMAP-L137 Low-Power Applications Processor 数据表 (Rev. G) (英语) PDF | HTML

用户指南

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OMAP-L137 C6000 DSP+ARM Processor Technical Reference Manual (Rev. D) (英语)

OMAP-L137

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数据表

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产品详情

CPU

1 Arm9

Frequency (MHz)

456

Coprocessors

C674x DSP

Display type

1 LCD

Protocols

Ethernet

Hardware accelerators

Industrial communications subsystem, Programable real-time unit

Operating system

Linux, RTOS

Security

Device attestation & anti-counterfeit, Secure storage

Rating

Catalog

Power supply solution

TPS65910

Operating temperature range (°C)

-40 to 125

CPU

1 Arm9

Frequency (MHz)

456

Coprocessors

C674x DSP

Display type

1 LCD

Protocols

Ethernet

Hardware accelerators

Industrial communications subsystem, Programable real-time unit

Operating system

Linux, RTOS

Security

Device attestation & anti-counterfeit, Secure storage

Rating

Catalog

Power supply solution

TPS65910

Operating temperature range (°C)

-40 to 125

PBGA (ZKB)

256

289 mm² (17 mm × 17 mm)

Software Support
- TI DSP/BIOS
- Chip Support Library and DSP Library
Dual Core SoC
- 375- and 456-MHz ARM926EJ-S RISC MPU
- 375- and 456-MHz C674x VLIW DSP
ARM926EJ-S Core
- 32-Bit and 16-Bit (Thumb®) Instructions
- DSP Instruction Extensions
- Single Cycle MAC
- ARM® Jazelle® Technology
- Embedded ICE-RT™ for Real-Time Debug
ARM9™ Memory Architecture
- 16KB of Instruction Cache
- 16KB of Data Cache
- 8KB of RAM (Vector Table)
- 64KB of ROM
C674x Instruction Set Features
- Superset of the C67x+ and C64x+ ISAs
- Up to 3648 MIPS and 2736 MFLOPS C674x
- Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
- 8-Bit Overflow Protection
- Bit-Field Extract, Set, Clear
- Normalization, Saturation, Bit-Counting
- Compact 16-Bit Instructions
C674x Two-Level Cache Memory Architecture
- 32KB of L1P Program RAM/Cache
- 32KB of L1D Data RAM/Cache
- 256KB of L2 Unified Mapped RAM/Cache
- Flexible RAM/Cache Partition (L1 and L2)
Enhanced Direct Memory Access Controller 3 (EDMA3):
- 2 Transfer Controllers
- 32 Independent DMA Channels
- 8 Quick DMA Channels
- Programmable Transfer Burst Size
TMS320C674x Fixed- and Floating-Point VLIW DSP Core
- Load-Store Architecture with Nonaligned Support
- 64 General-Purpose Registers (32-Bit)
- Six ALU (32- and 40-Bit) Functional Units
  - Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
  - Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
  - Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
- Two Multiply Functional Units
  - Mixed-Precision IEEE Floating Point Multiply Supported up to:
    - 2 SP x SP -> SP Per Clock
    - 2 SP x SP -> DP Every Two Clocks
    - 2 SP x DP -> DP Every Three Clocks
    - 2 DP x DP -> DP Every Four Clocks
  - Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
- Instruction Packing Reduces Code Size
- All Instructions Conditional
- Hardware Support for Modulo Loop
  Operation
- Protected Mode Operation
- Exceptions Support for Error Detection and Program Redirection
128KB of RAM Shared Memory
3.3-V LVCMOS I/Os (Except for USB Interfaces)
Two External Memory Interfaces:
- EMIFA
  - NOR (8- or 16-Bit-Wide Data)
  - NAND (8- or 16-Bit-Wide Data)
  - 16-Bit SDRAM with 128-MB Address Space
- EMIFB
  - 32-Bit or 16-Bit SDRAM with 256-MB Address Space
Three Configurable 16550-Type UART Modules:
- UART0 with Modem Control Signals
- Autoflow Control Signals (CTS, RTS) on UART0 Only
- 16-Byte FIFO
- 16x or 13x Oversampling Option
LCD Controller
Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
Two Master and Slave Inter-Integrated Circuit (I²C Bus™)
One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
Programmable Real-Time Unit Subsystem (PRUSS)
- Two Independent Programmable Realtime Unit (PRU) Cores
  - 32-Bit Load and Store RISC Architecture
  - 4KB of Instruction RAM per Core
  - 512 Bytes of Data RAM per Core
  - PRUSS can be Disabled via Software to Save Power
- Standard Power-Management Mechanism
  - Clock Gating
  - Entire Subsystem Under a Single PSC Clock Gating Domain
- Dedicated Interrupt Controller
- Dedicated Switched Central Resource
USB 1.1 OHCI (Host) with Integrated PHY (USB1)
USB 2.0 OTG Port with Integrated PHY (USB0)
- USB 2.0 High- and Full-Speed Client
- USB 2.0 High-, Full-, and Low-Speed Host
- End Point 0 (Control)
- End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
Three Multichannel Audio Serial Ports (McASPs):
- Six Clock Zones and 28 Serial Data Pins
- Supports TDM, I2S, and Similar Formats
- DIT-Capable (McASP2)
- FIFO Buffers for Transmit and Receive
10/100 Mbps Ethernet MAC (EMAC):
- IEEE 802.3 Compliant (3.3-V I/O Only)
- RMII Media-Independent Interface
- Management Data I/O (MDIO) Module
Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
Three Enhanced Pulse Width Modulators (eHRPWMs):
- Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
- 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
- Dead-Band Generation
- PWM Chopping by High-Frequency Carrier
- Trip Zone Input
Three 32-Bit Enhanced Capture (eCAP) Modules:
- Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
- Single-Shot Capture of up to Four Event Time-Stamps
Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
Commercial, Industrial, Extended, or Automotive Temperature

Software Support
- TI DSP/BIOS
- Chip Support Library and DSP Library
Dual Core SoC
- 375- and 456-MHz ARM926EJ-S RISC MPU
- 375- and 456-MHz C674x VLIW DSP
ARM926EJ-S Core
- 32-Bit and 16-Bit (Thumb®) Instructions
- DSP Instruction Extensions
- Single Cycle MAC
- ARM® Jazelle® Technology
- Embedded ICE-RT™ for Real-Time Debug
ARM9™ Memory Architecture
- 16KB of Instruction Cache
- 16KB of Data Cache
- 8KB of RAM (Vector Table)
- 64KB of ROM
C674x Instruction Set Features
- Superset of the C67x+ and C64x+ ISAs
- Up to 3648 MIPS and 2736 MFLOPS C674x
- Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
- 8-Bit Overflow Protection
- Bit-Field Extract, Set, Clear
- Normalization, Saturation, Bit-Counting
- Compact 16-Bit Instructions
C674x Two-Level Cache Memory Architecture
- 32KB of L1P Program RAM/Cache
- 32KB of L1D Data RAM/Cache
- 256KB of L2 Unified Mapped RAM/Cache
- Flexible RAM/Cache Partition (L1 and L2)
Enhanced Direct Memory Access Controller 3 (EDMA3):
- 2 Transfer Controllers
- 32 Independent DMA Channels
- 8 Quick DMA Channels
- Programmable Transfer Burst Size
TMS320C674x Fixed- and Floating-Point VLIW DSP Core
- Load-Store Architecture with Nonaligned Support
- 64 General-Purpose Registers (32-Bit)
- Six ALU (32- and 40-Bit) Functional Units
  - Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
  - Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
  - Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
- Two Multiply Functional Units
  - Mixed-Precision IEEE Floating Point Multiply Supported up to:
    - 2 SP x SP -> SP Per Clock
    - 2 SP x SP -> DP Every Two Clocks
    - 2 SP x DP -> DP Every Three Clocks
    - 2 DP x DP -> DP Every Four Clocks
  - Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
- Instruction Packing Reduces Code Size
- All Instructions Conditional
- Hardware Support for Modulo Loop
  Operation
- Protected Mode Operation
- Exceptions Support for Error Detection and Program Redirection
128KB of RAM Shared Memory
3.3-V LVCMOS I/Os (Except for USB Interfaces)
Two External Memory Interfaces:
- EMIFA
  - NOR (8- or 16-Bit-Wide Data)
  - NAND (8- or 16-Bit-Wide Data)
  - 16-Bit SDRAM with 128-MB Address Space
- EMIFB
  - 32-Bit or 16-Bit SDRAM with 256-MB Address Space
Three Configurable 16550-Type UART Modules:
- UART0 with Modem Control Signals
- Autoflow Control Signals (CTS, RTS) on UART0 Only
- 16-Byte FIFO
- 16x or 13x Oversampling Option
LCD Controller
Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
Two Master and Slave Inter-Integrated Circuit (I²C Bus™)
One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
Programmable Real-Time Unit Subsystem (PRUSS)
- Two Independent Programmable Realtime Unit (PRU) Cores
  - 32-Bit Load and Store RISC Architecture
  - 4KB of Instruction RAM per Core
  - 512 Bytes of Data RAM per Core
  - PRUSS can be Disabled via Software to Save Power
- Standard Power-Management Mechanism
  - Clock Gating
  - Entire Subsystem Under a Single PSC Clock Gating Domain
- Dedicated Interrupt Controller
- Dedicated Switched Central Resource
USB 1.1 OHCI (Host) with Integrated PHY (USB1)
USB 2.0 OTG Port with Integrated PHY (USB0)
- USB 2.0 High- and Full-Speed Client
- USB 2.0 High-, Full-, and Low-Speed Host
- End Point 0 (Control)
- End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
Three Multichannel Audio Serial Ports (McASPs):
- Six Clock Zones and 28 Serial Data Pins
- Supports TDM, I2S, and Similar Formats
- DIT-Capable (McASP2)
- FIFO Buffers for Transmit and Receive
10/100 Mbps Ethernet MAC (EMAC):
- IEEE 802.3 Compliant (3.3-V I/O Only)
- RMII Media-Independent Interface
- Management Data I/O (MDIO) Module
Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
Three Enhanced Pulse Width Modulators (eHRPWMs):
- Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
- 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
- Dead-Band Generation
- PWM Chopping by High-Frequency Carrier
- Trip Zone Input
Three 32-Bit Enhanced Capture (eCAP) Modules:
- Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
- Single-Shot Capture of up to Four Event Time-Stamps
Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
Commercial, Industrial, Extended, or Automotive Temperature

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I²C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

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顶层文档	类型	标题	格式选项	下载最新的英语版本		日期
*	数据表	OMAP-L137 Low-Power Applications Processor 数据表 (Rev. G)	PDF \| HTML			2014-6-17
*	用户指南	OMAP-L137 C6000 DSP+ARM Processor Technical Reference Manual (Rev. D)				2016-9-21
*	勘误表	OMAP-L137 C6000 DSP+ARM Processor Errata (Silicon Revs 3.0, 2.1, 2.0, 1.1 & 1.0) (Rev. I)				2014-6-17
	用户指南	ARM 汇编语言工具 v20.2.0.LTS (Rev. Z)	PDF \| HTML	英语版 (Rev.Z)	PDF \| HTML	2023-4-13
	用户指南	ARM 优化 C/C++ 编译器 v20.2.0.LTS (Rev. W)	PDF \| HTML	英语版 (Rev.W)	PDF \| HTML	2023-4-13
	应用手册	高速接口布局指南 (Rev. J)	PDF \| HTML	英语版 (Rev.J)	PDF \| HTML	2023-3-23
	用户指南	SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V)				2020-6-1
	应用手册	General Hardware Design/BGA PCB Design/BGA	PDF \| HTML			2019-2-22
	应用手册	OMAP-L13x / C674x / AM1x schematic review guidelines	PDF \| HTML			2019-2-14
	应用手册	McASP Design Guide - Tips, Tricks, and Practical Examples				2019-1-10
	白皮书	Designing professional audio mixers for every scenario				2018-6-28
	用户指南	TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U)				2012-8-21
	用户指南	TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W)				2012-8-21
	应用手册	Using the OMAP-L1x7 Bootloader (Rev. G)				2012-6-1
	应用手册	Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061				2012-4-13
	白皮书	MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A)				2012-2-2
	应用手册	Introduction to TMS320C6000 DSP Optimization				2011-10-6
	用户指南	TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F)				2011-9-14
	白皮书	OpenCV on TI’s DSP+ARM®				2011-7-27
	白皮书	Software and Hardware Design Challenges Due to Dynamic Raw NAND Market				2011-5-19
	应用手册	使用离散 DC/DC 转换器和 LDO 的电源解决方案 (Rev. B)		英语版 (Rev.B)		2010-10-8
	用户指南	TMS320C674x DSP Megamodule Reference Guide (Rev. A)				2010-8-3
	用户指南	TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B)				2010-7-30
	应用手册	OMAP-L137 Power Consumption Summary				2010-6-30
	应用手册	Power Solution using a Dual DCDC Converter and a LDO (Rev. A)				2010-3-25
	应用手册	Power Solution using LDO's (Rev. A)				2010-3-25
	更多文献资料	OMAP-L1x Software Solutions Diagram (Rev. B)				2009-12-7
	应用手册	Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB				2009-11-25
	应用手册	OMAP-L137 TMS320C6747/6745/6743 Pin Multiplexing Utility (Rev. A)				2009-9-26
	应用手册	OMAP-L137 Complementary Products				2009-9-23
	白皮书	Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core				2009-6-24
	应用手册	TMS320C6747/45/43 & OMAP-L1x7 USB Downstream Host Compliance Testing				2009-3-12
	应用手册	TMS320C6747/45/43 & OMAP-L1x7 USB Upstream Device Compliance Testing				2009-3-12
	应用手册	TMS320C674x/OMAP-L1x USB Compliance Checklist				2009-3-12
	应用手册	OMAP-L137 Technical Brief (Rev. B)				2009-2-18
	用户指南	TMS320C674x DSP Cache User's Guide (Rev. A)				2009-2-11

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TMDSOSKL137 — OMAP-L137/TMS320C6747 浮点入门套件

与 Spectrum Digital Inc. 联合开发的 OMAP-L137/TMS320C6747 浮点入门套件是一个低成本开发平台，旨在加快基于 TI OMAP-L13x 应用处理器和 TMS320C674x 定点/浮点 DSP（TMS320C6747、TMS320C6745 和 TMS320C6743）的高精度应用的开发。该套件通过 USB 通信真正实现即插即用功能。初级和熟练的设计人员都可以使用该入门套件的全功能 Code Composer Studio™ 集成开发环境 (IDE) 和 eXpressDSP™ 软件（包含 DSP/BIOS™ (...)

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XDS200 是用于调试 TI 嵌入式器件的调试探针（仿真器）。对于大多数器件，建议使用较新、成本较低的 XDS110 (www.ti.com/tool/TMDSEMU110-U)。XDS200 在单个仓体中支持更广泛的标准（IEEE1149.1、IEEE1149.7、SWD）。所有 XDS 调试探针在所有具有嵌入式跟踪缓冲器 (ETB) 的 Arm® 和 DSP 处理器中均支持内核和系统跟踪。

XDS200 通过 TI 20 引脚连接器（带有适用于 TI 14 引脚、Arm Cortex® 10 引脚和 Arm 20 引脚的多个适配器）连接到目标板，并通过 USB2.0 高速 (...)

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XDS560v2 是 XDS560™ 系列调试探针中性能最高的一款，同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。请注意，它不支持串行线调试 (SWD)。

对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS 调试探针均支持核心和系统跟踪。对于引脚上的跟踪，则需要使用 XDS560v2 PRO TRACE。

XDS560v2 通过 MIPI HSPT 60 引脚连接器（带有多个用于 TI 14 引脚、TI 20 引脚和 ARM 20 引脚的适配器）连接到目标板，并通过 USB2.0 高速 (...)

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XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针（仿真器）的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款，同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

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软件开发套件 (SDK)

PROCESSOR-SDK-RTOS-OMAPL137 — 适用于 OMAP-L137 和 C6747、C6745、C6743 的 RTOS 处理器 SDK

Processor SDK（软件开发套件）是统一的软件平台，适用于 TI 嵌入式处理器，设置简单，提供开箱即用的快速基准测试和演示。 Processor SDK 的所有版本在 TI 的广泛产品系列中保持一致，让开发人员可以无缝地在多种器件之间重用和迁移软件。借助 Processor SDK 和 TI 的嵌入式处理器解决方案，开发可扩展平台解决方案从未如此简单。

适用于 OMAP-L137 的处理器 SDK，包括对 Linux 和 TI-RTOS 操作系统的支持。

RTOS 亮点：

TI RTOS 内核，适用于 TI 器件的轻量级实时嵌入式操作系统
芯片支持库、驱动程序和基本的板级支持实用程序
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IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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操作系统 (OS)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)

来源：Mentor Graphics Corporation

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驱动程序或库

MATHLIB — 用于浮点器件的 DSP 数学函数库

德州仪器 (TI) 数学库是优化的浮点数学函数库，用于使用 TI 浮点器件的 C 编程器。这些例程通常用于计算密集型实时应用，最佳执行速度是这些应用的关键。通过使用这些例程（而不是在现有运行时支持中找到的例程），您可以在无需重写现有代码的情况下获得更快的执行速度。MATHLIB 库包括目前在现有实时支持库中提供的所有浮点数学例程。这些新函数可称为当前实时支持库名称或包含在数学库中的新名称。

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驱动程序或库

SPRC264 — TMS320C5000/6000 图像库 (IMGLIB)

C5000/6000 图像处理库 (IMGLIB) 是一款经过优化的图像/视频处理函数库，适用于 C 语言程序员。其中包括计算量庞大的实时应用程序常用的可使用 C 语言调用的通用影像/视频处理例程。使用这些例程可实现比等效标准 ANSI C 语言代码更高的性能。通过使用源代码提供即用型 DSP 函数，IMGLIB 可以显著缩短应用开发时间。

请参阅基准测试：DSP 内核基准测试

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驱动程序或库

SPRC265 — TMS320C6000 DSP 库 (DSPLIB)

TMS320C6000 数字信号处理器库 (DSPLIB) 是一款平台优化型 DSP 函数库，适用于 C 编程器。它包括 C 语言可调用的通用信号处理例程，通常用于计算密集型的实时应用中。使用这些例程可实现比等效标准 ANSI C 语言代码更高的性能。通过使用源代码提供即用型 DSP 函数，DSPLIB 可以显著缩短应用开发时间。

请参阅基准测试：DSP 内核基准测试

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TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

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WIND-3P-VXWORKS-LINUX-OS — Wind River 处理器 VxWorks 和 Linux 操作系统

Wind River 是提供物联网 (IoT) 软件的全球领导者。自 1981 年以来，该公司的技术一直在为全世界最安全的器件提供支持，现在已广泛应用于超过 20 亿产品中。Wind River 提供全面的边缘到云产品系列，并针对这些产品提供世界一流的全球专业服务和备受赞誉的客户支持。Wind River 的 VxWorks 和 Linux 产品支持各种 TI 处理器。

如需了解有关 Wind River 的更多信息，请访问 https://www.windriver.com。

来源：Wind River Systems

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软件编解码器

ADT-3P-DSPVOIPCODECS — 自适应数字技术 DSP VOIP、语音和音频编解码器

Adaptive Digital 是音质增强算法的开发公司，提供可与 TI DSP 配合使用的一流声学回声消除软件。Adaptive Digital 在算法开发、实施、优化和配置调优方面具有丰富的经验。他们提供适用于语音技术、音质软件、回声消除、会议软件、语音压缩算法的解决方案和即用型解决方案。

如需了解有关 Adaptive Digital 的更多信息，请访问 https://www.adaptivedigital.com。

来源：Adaptive Digital Technologies, Inc.

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软件编解码器

AURO-3P-3DENGINE — Auro Technologies, Auro-3D Engine with Auro-Codec Decoder and Auro-Matic up-mixing

Auro Technologies’ Auro-Engine includes their Auro-Codec and Auro-Matic elements for real time audio stream encoding and up mixing affording 3D audio user experiences. The Auro-Codec and Auro-Matic algorithms have been ported to select TI C6x DSPs.

来源：Auro Technologies N.V.

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