TPSI2240-Q1
Verstärkt isolierter Schalter für die Automobilindustrie mit Avalanche-Schutz, 1200 V, 50 mA
TPSI2240-Q1
- Qualified for automotive applications
- AEC-Q100 grade 1: –40 to 125°C TA
- Low EMI:
- Meets CISPR25 class 5 performance with no additional components
- Integrated avalanche rated MOSFETs
- Designed and qualified for reliability for dielectric withstand testing (Hi-Pot)
- TPSI2240-Q1 IAVA = 1mA for 60s pulses
-
TPSI2240C-Q1 IAVA = 0.6mA for 60s pulses
- TPSI2240T-Q1 IAVA = 3mA for 60s pulses
- 1200V standoff voltage
- RON = 130Ω (TJ = 25°C)
- TON, TOFF < 700µs
- IOFF = 1.22µA at 1000V (TJ = 105°C)
- Designed and qualified for reliability for dielectric withstand testing (Hi-Pot)
- Low primary side supply current
- 3.5µA OFF state current (TJ = 25°C)
- Functional Safety Capable
- Documentation available to aid in ISO 26262 and IEC 61508 system design
- Robust isolation barrier:
- > 30 year projected lifetime at 1500VRMS / 2120VDC working voltage
- Reinforced Isolation rating, VISO, up to 4750VRMS
- SOIC 11-pin (DWQ) package with wide pins for improved thermal performance
- Creepage and clearance ≥ 8mm (primary-secondary)
- Creepage and clearance ≥ 6mm (across switch terminals)
- Safety-related certifications
- (Planned) DIN EN IEC 60747-17 (VDE 0884-17)
- (Planned) UL 1577 component recognition program
The TPSI2240-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2240-Q1 uses TIs high reliability capacitive reinforced isolation technology in combination with internal back-to-back MOSFETs to form an integrated solution requiring no secondary side power supply.
The primary side of the device is powered by only 5mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 4.5V – 20V and the EN pin of the device should be driven by a GPIO output with logic HI between 2.1V – 20V. In other applications, the VDD and EN pins could be driven together directly from the system supply or from a GPIO output. All control configurations of the TPSI2240-Q1 do not require additional external components such as a resistor and/or low side switch that are typically required in photo relay solutions.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±1.2kV from S1 to S2. The TPSI2240-Q1 MOSFETs avalanche robustness and thermally conscious package design, allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 1mA (0.6mA for TPSI2240C-Q1 and 3mA for TPSI2240T-Q1) without requiring any external components.
Technische Dokumentation
| Top-Dokumentation | Typ | Titel | Format-Optionen | Datum |
|---|---|---|---|---|
| * | Data sheet | TPSI2240-Q1 1200V, 50mA, Automotive Reinforced Solid-State Relay With Avalanche Protection datasheet (Rev. A) | PDF | HTML | 12 Dez 2025 |
| Application note | Design of Insulation Monitoring Device (IMD) in On-board Charger System With Active Single-Switch Architecture | PDF | HTML | 30 Jan 2026 | |
| Functional safety information | TPSI2240-Q1, TPSI2240C-Q1, and TPSI2240T-Q1 Functional Safety FIT Rate, FMD and Pin FMA (Rev. A) | PDF | HTML | 26 Jan 2026 | |
| Application note | Design Considerations for Large Y-Capacitor Resistive-Bridge DC Insulation Monitoring Device | PDF | HTML | 15 Jan 2026 | |
| Certificate | TPSI2240Q1EVM EU Declaration of Conformity (DoC) | 01 Jul 2025 |
Design und Entwicklung
Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.
TPSI2240Q1EVM — TPSI2240-Q1 – Evaluierungsmodul
TIDA-010985 — Referenzdesign: Isolationsüberwachung für Widerstandsmessbrücken in 800-VDC-Systemen m. großem Y-Cap
| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| SOIC (DWQ) | 11 | Ultra Librarian |
Bestellen & Qualität
- RoHS
- REACH
- Bausteinkennzeichnung
- Blei-Finish/Ball-Material
- MSL-Rating / Spitzenrückfluss
- MTBF-/FIT-Schätzungen
- Materialinhalt
- Qualifikationszusammenfassung
- Kontinuierliches Zuverlässigkeitsmonitoring
- Werksstandort
- Montagestandort
Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.
Support und Schulungen
TI E2E™-Foren mit technischem Support von TI-Ingenieuren
Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.
Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support.