Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
| Top-Dokumentation | Typ | Titel | Format-Optionen | Neueste englische Version herunterladen | Datum | |
|---|---|---|---|---|---|---|
| * | Datenblatt | FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. A) | PDF | HTML | 10.10.2024 | ||
| Anwendungshinweis | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 22.06.2021 | |||
| Anwendungshinweis | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 16.06.2021 | |||
| Anwendungshinweis | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 20.10.2017 | ||||
| Anwendungshinweis | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 27.05.2016 | |||
| Anwendungshinweis | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 18.01.2016 | |||
| Anwendungshinweis | Derivative Integration Algorithm for Proximity Sensing | 29.09.2015 | ||||
| Anwendungshinweis | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 24.07.2015 |
Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.
| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| WQFN (RGH) | 16 | Ultra Librarian |
Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.
Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support.