UCC35705
- Greater Than 4-MHz Operation
- Integrated Oscillator / Voltage Feed Forward Compensation
- >4:1 Input Voltage Range
- 25-ns Current Limit Delay
- Programmable Maximum Duty Cycle Clamp
- Optocoupler Interface
- 50-µA Start-Up Current
- 4.2-mA Operating Current @ 1 MHz
- Smallest Footprint of the 8-pin MSOP Package Minimizes
Board Area and Height
The UCC35705 and UCC35706 devices are 8-pin voltage mode primary side controllers with fast over-current protection. These devices are used as core high-speed building blocks in high performance isolated and non-isolated power converters.
UCC35705/UCC35706 devices feature a high speed oscillator with integrated feed-forward compensation for improved converter performance. A typical current sense to output delay time of 25 ns provides fast response to overload conditions. The IC also provides an accurate programmable maximum duty cycle clamp for increased protection which can also be disabled for the oscillator to run at maximum possible duty cycle.
Two UVLO options are offered. The UCC35705 with lower turn-on voltage is intended for dc-to-dc converters while the higher turn-on voltage and the wider UVLO range of the UCC35706 is better suited for offline applications.
The UCC35705/UCC35706 family is offered in 8-pin MSOP (DGK), SOIC (D) and PDIP (P) packages.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | High Speed Voltage Mode Pulse Width Modulator 数据表 (Rev. B) | 2010年 10月 15日 | |||
选择指南 | 电源管理指南 2018 (Rev. K) | 2018年 7月 31日 | ||||
选择指南 | 电源管理指南 2018 (Rev. R) | 2018年 6月 25日 | ||||
用户指南 | Using the UCC35705 | 2002年 11月 18日 | ||||
更多文献资料 | Seminar 300 Topic 8 - Switching Power Supply Design Review | 2001年 2月 15日 | ||||
更多文献资料 | Seminar 400 Topic 2 - Design of Flyback Transformers and Filter Inductors | 2001年 2月 15日 |
设计和开发
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UCC35705OR6CALC — 免费工具:UCC35705/6 设计计算器
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点