UCC2818-EP
- Controls Boost Preregulator to Near-Unity Power Factor
- Limits Line Distortion
- World-Wide Line Operation
- Overvoltage Protection
- Accurate Power Limiting
- Average Current Mode Control
- Improved Noise Immunity
- Improved Feed-Forward Line Regulation
- Leading Edge Modulation
- 150-µA Typical Start-Up Current
- Low-Power BiCMOS Operation
- 12-V to 17-V Operation
- SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Military (–55°C/125°C) Temperature Range(1)
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
(1) Additional temperature ranges are available - contact factory
Unitrode Is a trademark of Texas Instruments.
The UCC2817 and UCC2818 provides all the functions necessary for active power-factor-corrected preregulators. The controller achieves near-unity power factor by shaping the ac-input line current waveform to correspond to that of the ac input line voltage. Average current mode control maintains stable, low-distortion sinusoidal line current.
Designed with TIs BiCMOS process, the UCC2817 and UCC2818 offers new features, such as lower start-up current, lower power dissipation, overvoltage protection, a shunt UVLO detect circuitry, a leading-edge modulation technique to reduce ripple current in the bulk capacitor, and an improved, low-offset (±2-mV) current amplifier to reduce distortion at light load conditions.
The UCC2817 offers an on-chip shunt regulator with low start-up current suitable for applications utilizing a bootstrap supply. The UCC2818 is intended for applications with a fixed supply (VCC).
The devices are available in a 16-pin D package.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | UCC2718-EP, UCC2818-EP 数据表 | 2008年 12月 4日 | |||
* | VID | UCC2818-EP VID V6209617 | 2016年 6月 21日 | |||
* | 辐射与可靠性报告 | UCC2818MDREP Reliability Report | 2011年 8月 26日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点