UC3708
- 3.0A Peak Current Totem Pole Output
- 5 to 35V Operation
- 25ns Rise and Fall Times
- 25ns Propagation Delays
- Thermal Shutdown and Under-Voltage Protection
- High-Speed, Power MOSFET Compatible
- Efficient High Frequency Operation
- Low Cross-Conduction Current Spike
- Enable and Shutdown Functions
- Wide Input Voltage Range
- ESD Protection to 2kV
The UC1708 family of power drivers is made with a high-speed, high-voltage, Schottky process to interface control functions and high-power switching devices particularly power MOSFETs. Operating over a 5 V to 35 V supply range, these devices contain two independent channels. The A and B inputs are compatible with TTL and CMOS logic families, but can withstand input voltages as high as VIN. Each output can source or sink up to 3 A as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs, they can be forced low in common through the action of either a digital high signal at the Shutdown terminal or by forcing the Enable terminal low. The Shutdown terminal will only force the outputs low, it will not effect the behavior of the rest of the device. The Enable terminal effectively places the device in under-voltage lockout, reducing power consumption by as much as 90%. During under-voltage and disable (Enable terminal forced low) conditions, the outputs are held in a self-biasing, low-voltage, state.
The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin bat-wing DIP packages for commercial operation over a 0°C to 70°C temperature range and industrial temperature range of -25°C to 85°C respectively. For operation over a -55°C to 125°C temperature range, the UC1708 is available in hermetically sealed 8-pin MINI CDIP, 16 pin CDIP and 20 pin CLCC packages. Surface mount devices are also available.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | Dual Non-Inverting Power Driver 数据表 (Rev. C) | 2007年 9月 25日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点