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交流/直流和直流/直流控制器（外部 FET）

UC1843A-EP

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电流模式 Pwm 控制器（增强型产品）

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数据表

UC1843A-EP

正在供货
数据表 立即订购

产品详情

Rating HiRel Enhanced Product Topology Boost, Flyback, Forward Vin (max) (V) 25 Control mode Current Features Error amplifier, Fixed frequency, Multi-topology Operating temperature range (°C) -55 to 125 Duty cycle (max) (%) 100
Rating HiRel Enhanced Product Topology Boost, Flyback, Forward Vin (max) (V) 25 Control mode Current Features Error amplifier, Fixed frequency, Multi-topology Operating temperature range (°C) -55 to 125 Duty cycle (max) (%) 100
SOIC (D) 8 29.4 mm² 4.9 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree(1)
  • Optimized for Off-line and DC-to-DC Converters
  • Low Start Up Current (<0.5 mA)
  • Trimmed Oscillator Discharge Current
  • Automatic Feed Forward Compensation
  • Pulse-by-Pulse Current Limiting
  • Enhanced Load Response Characteristics
  • Under-Voltage Lockout With Hysteresis
  • Double Pulse Suppression
  • High Current Totem Pole Output
  • Internally Trimmed Bandgap Reference
  • 500 kHz Operation
  • Low RO Error Amp

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree(1)
  • Optimized for Off-line and DC-to-DC Converters
  • Low Start Up Current (<0.5 mA)
  • Trimmed Oscillator Discharge Current
  • Automatic Feed Forward Compensation
  • Pulse-by-Pulse Current Limiting
  • Enhanced Load Response Characteristics
  • Under-Voltage Lockout With Hysteresis
  • Double Pulse Suppression
  • High Current Totem Pole Output
  • Internally Trimmed Bandgap Reference
  • 500 kHz Operation
  • Low RO Error Amp

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The UC1842A/3A/4A/5A family of control ICs is a pin-for-pin compatible improved version of the UC3842/3/4/5 family. Providing the necessary features to control current mode switched mode power supplies, this family has the following improved features. Start up current is guaranteed to be less than 0.5 mA. Oscillator discharge is trimmed to 8.3 mA. During under voltage lockout, the output stage can sink at least 10 mA at less than 1.2 V for VCC over 5 V.

The UC1842A/3A/4A/5A family of control ICs is a pin-for-pin compatible improved version of the UC3842/3/4/5 family. Providing the necessary features to control current mode switched mode power supplies, this family has the following improved features. Start up current is guaranteed to be less than 0.5 mA. Oscillator discharge is trimmed to 8.3 mA. During under voltage lockout, the output stage can sink at least 10 mA at less than 1.2 V for VCC over 5 V.
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类型 标题 下载最新的英语版本 日期
* 辐射与可靠性报告 UC1843AMDREP Reliability Report 2014年 12月 22日
* 数据表 Current-Mode PWM Controller. 数据表 (Rev. D) 2013年 1月 14日

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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