TXG4122
- Bidirectional I2C compatible communication
- Support for Standard-mode, Fast-mode, and Fast-mode Plus I2C operation
- Supports DV shifts up to ±40V
- Data rate up to 1MHz
- Side 1 Supply Range: 3V to 5.5V
- Side 2 Supply Range: 2.25V to 5.5V
- Maximum capacitive load:
- 80pF (Side 1) and 550pF (Side 2)
- Open -drain outputs with current sink capability:
- 16.5mA (Side 1) and 30mA (Side 2)
- Low power consumption at 400kHz (typical):
- ICC1 = 4.2mA, ICC2 = 0.9mA
- Operating temperature from –40°C to +125°C
- CMTI of 2kV/µs
- Latch-up performance exceeds 100mA per JESD 78, class II
- ESD protection exceeds JESD 22
- 2000V human-body model
- 500V charged-device model
- Package options provided: SOIC (8D), WSON (8DSG), SOT-23 (8DDF)
The TXG4122 device is a dual bidirectional, non-galvanic based voltage and ground-level translator for I2C. This device supports two separate configurable power-supply rails. Side 1 is designed to track VCC1 which accepts any supply voltage from 3V to 5.5V. Side 2 is designed to track VCC2 which accepts any supply voltage from 2.25V to 5.5V. Compared to traditional level shifters, the TXG4122 can solve the challenges of voltage translation across different ground levels up to ±40V. Both GND1 or GND2 can have an offset ground as long as the difference between GND1 and GND2 remains -40V to +40V.
The Simplified Block Diagram shows a common use case where DC shift occurs between GND1 to GND2 due to parasitic resistance or capacitance. The TXG4122 is able to support I2C-based communication between systems that have different supply voltages and different ground references. The leakage between GND1 and GND2 is typically 25nA when VCC to GND is shorted.
技术文档
| 顶层文档 | 类型 | 标题 | 格式选项 | 下载最新的英语版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 数据表 | TXG4122 ± 40V Bidirectional Ground-Level Translator for I2C 数据表 | PDF | HTML | 2026年 6月 15日 |
设计与开发
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TXG-4CH-EVM — 4 通道接地电平转换器的 TXG 评估模块
| 封装 | 引脚 | CAD 符号、封装和 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点