产品详细信息

Protocols RGB, Composite Configuration 2:1 SPDT Number of channels (#) 4 Bandwidth (MHz) 500 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 700 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) -80 ESD CDM (kV) 1 ICC (Typ) (uA) 700 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 3.5 CON (Typ) (pF) 10.5 Off isolation (Typ) (dB) -60 OFF-state leakage current (Max) (µA) 1 Propagation delay (ns) 2 Ron (Max) (Ohms) 6 RON flatness (Typ) (Ohms) 1 Turn off time (disable) (Max) (ns) 7 Turn on time (enable) (Max) (ns) 7 VIH (Min) (V) 2 VIL (Max) (V) 0.8
Protocols RGB, Composite Configuration 2:1 SPDT Number of channels (#) 4 Bandwidth (MHz) 500 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 700 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) -80 ESD CDM (kV) 1 ICC (Typ) (uA) 700 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 3.5 CON (Typ) (pF) 10.5 Off isolation (Typ) (dB) -60 OFF-state leakage current (Max) (µA) 1 Propagation delay (ns) 2 Ron (Max) (Ohms) 6 RON flatness (Typ) (Ohms) 1 Turn off time (disable) (Max) (ns) 7 Turn on time (enable) (Max) (ns) 7 VIH (Min) (V) 2 VIL (Max) (V) 0.8
SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 TVSOP (DGV) 16 23 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Low Differential Gain and Phase (DG = 0.2%, DP = 0.1° Typ)
  • Wide Bandwidth (BW = 500 MHz Typ)
  • Low Crosstalk (XTALK = –80 dB Typ)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low and Flat ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

  • Low Differential Gain and Phase (DG = 0.2%, DP = 0.1° Typ)
  • Wide Bandwidth (BW = 500 MHz Typ)
  • Low Crosstalk (XTALK = –80 dB Typ)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low and Flat ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

The TI video switch TS3V340 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN)\ input. When EN\ is low, the switch is enabled and the D port is connected to the S port. When EN\ is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase makes this switch ideal for composite and RGB video applications. The device has a wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TI video switch TS3V340 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN)\ input. When EN\ is low, the switch is enabled and the D port is connected to the S port. When EN\ is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase makes this switch ideal for composite and RGB video applications. The device has a wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

下载

技术文档

star = TI 精选相关文档
未找到结果。请清除搜索,并重试。
显示全部 3 项
类型 标题 下载最新的英文版本 日期
* 数据表 TS3V340 数据表 (Rev. A) 2004年 12月 2日
应用手册 防止模拟开关的额外功耗 下载英文版本 2008年 7月 15日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

接口适配器

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。     

现货
数量限制: 3
接口适配器

LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器

EVM-LEADLESS1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面贴装封装转换为 100mil DIP 接头。
现货
数量限制: 3
仿真模型

TS3V340 IBIS Model

SCDM095.ZIP (44 KB) - IBIS Model
封装 引脚 下载
SOIC (D) 16 了解详情
SSOP (DBQ) 16 了解详情
TSSOP (PW) 16 了解详情
TVSOP (DGV) 16 了解详情
VQFN (RGY) 16 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

推荐产品的参数、评估模块或参考设计可能与此 TI 产品相关

支持与培训

视频