产品详情

Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
Protocols USB 2.0 Configuration 1:1 SPST Number of channels 2 USB speed (Mbps) 480 Bandwidth (MHz) 1220 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 ESD HBM (typ) (kV) 6 Operating temperature range (°C) -40 to 85 COFF (typ) (pF) 2 CON (typ) (pF) 6 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 10000 Ron channel match (max) (Ω) 0.35 Turnoff time (disable) (max) (ns) 25 Turnon time (enable) (max) (ns) 30 Rating Catalog
UQFN (RSE) 8 2.25 mm² 1.5 x 1.5
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
  • VCC Operation at 3 V and 4.3 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down Mode Operation
  • ron = 10 Ω Maximum
  • Δron <0.35 Ω Typical
  • Cio(ON) = 6 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • ESD Performance Tested Per JESD 22
    • 6000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 250-V Machine Model (A115-A)
  • Wide –3-dB Bandwidth = 1220 MHz Typical
  • Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB31 is a 1:1 SPST high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals. This device comes in a small UQFN package for use in a handset or consumer applications, such as cell phones, digital cameras, and notebooks with hubs. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

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类型 标题 下载最新的英语版本 日期
* 数据表 TS3USB31 1:1 SPST High-Speed USB 2.0 (480-Mbps) Bus Isolation Switch With Single Enable 数据表 (Rev. E) PDF | HTML 2016年 8月 25日
应用手册 根据带宽选择无源多路复用器 (Rev. A) PDF | HTML 英语版 (Rev.A) PDF | HTML 2024年 8月 30日
应用手册 High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018年 6月 14日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

仿真模型

HSPICE Model for TS3USB31

SCDJ042.ZIP (95 KB) - HSpice Model
仿真模型

TS3USB31 IBIS Model

SCDM099.ZIP (16 KB) - IBIS Model
封装 引脚 CAD 符号、封装和 3D 模型
UQFN (RSE) 8 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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