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特定于协议的开关和多路复用器

TS3L100

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3.3V、2:1 (SPDT)、4 通道 LAN 开关

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TS3L100

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产品详情

Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 350 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 10000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 0.1 ESD HBM (typ) (kV) 2 Operating temperature range (°C) 0 to 70 Crosstalk (dB) -68 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 10 CON (typ) (pF) 3 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.0075 Ron (max) (mΩ) 15000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 3.5 Turnon time (enable) (max) (ns) 7.5 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols 10 BASE-T, 100 BASE-T, LAN Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 350 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 10000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 0.1 ESD HBM (typ) (kV) 2 Operating temperature range (°C) 0 to 70 Crosstalk (dB) -68 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 10 CON (typ) (pF) 3 Off isolation (typ) (dB) -42 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.0075 Ron (max) (mΩ) 15000 Ron channel match (max) (Ω) 1 RON flatness (typ) (Ω) 1 Turnoff time (disable) (max) (ns) 3.5 Turnon time (enable) (max) (ns) 7.5 VIH (min) (V) 2 VIL (max) (V) 0.8
SOIC (D) 16 59.4 mm² 9.9 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 TVSOP (DGV) 16 23.04 mm² 3.6 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling
  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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类型 标题 下载最新的英语版本 日期
* 数据表 TS3L100 数据表 (Rev. A) 2004年 10月 12日
应用手册 防止模拟开关的额外功耗 英语版 2008年 7月 15日
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
更多文献资料 TS5L100 and TS3L100 Application Clip 2004年 5月 25日

设计和开发

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接口适配器

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。     

用户指南: PDF
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接口适配器

LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器

EVM-LEADLESS1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面贴装封装转换为 100mil DIP 接头。
用户指南: PDF
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封装 引脚 下载
SOIC (D) 16 查看选项
SSOP (DBQ) 16 查看选项
TSSOP (PW) 16 查看选项
TVSOP (DGV) 16 查看选项
VQFN (RGY) 16 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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