产品详情

Output power (W) 0.138 Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 16 PSRR (dB) 109 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control Yes Shutdown current (ISD) (µA) 0.4 Architecture Class-AB Iq per channel (typ) (mA) 2
Output power (W) 0.138 Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Load (min) (Ω) 16 PSRR (dB) 109 Rating Catalog Operating temperature range (°C) -40 to 85 Headphone channels Stereo Volume control Yes Shutdown current (ISD) (µA) 0.4 Architecture Class-AB Iq per channel (typ) (mA) 2
DSBGA (YZH) 16 5.0625 mm² 2.25 x 2.25 WQFN (RTJ) 20 16 mm² 4 x 4
  • DirectPath™ Ground-Referenced Outputs
    • Eliminates Output DC Blocking Capacitors
    • Reduces Board Area
    • Reduces Component Height and Cost
    • Full Bass Response Without Attenuation
  • Power Supply Voltage Range: 2.5 V to 5.5 V
  • 64 Step Audio Taper Volume Control
  • High Power Supply Rejection Ratio
    (>100 dB PSRR)
  • Differential Inputs for Maximum Noise Rejection
    (68 dB CMRR)
  • High-Impedance Outputs When Disabled
  • Advanced Pop and Click Suppression Circuitry
  • Digital I2C Bus Control
    • Per Channel Mute and Enable
    • Software Shutdown
    • Multi-Mode Support: Stereo HP, Dual Mono
      HP, and Single-Channel BTL Operation
    • Amplifier Status
  • Space Saving Packages
    • 20 Pin, 4 mm × 4 mm QFN
    • 16 ball, 2 mm × 2 mm DSBGA
  • ESD Protection of 8 kV HBM and IEC Contact
  • DirectPath™ Ground-Referenced Outputs
    • Eliminates Output DC Blocking Capacitors
    • Reduces Board Area
    • Reduces Component Height and Cost
    • Full Bass Response Without Attenuation
  • Power Supply Voltage Range: 2.5 V to 5.5 V
  • 64 Step Audio Taper Volume Control
  • High Power Supply Rejection Ratio
    (>100 dB PSRR)
  • Differential Inputs for Maximum Noise Rejection
    (68 dB CMRR)
  • High-Impedance Outputs When Disabled
  • Advanced Pop and Click Suppression Circuitry
  • Digital I2C Bus Control
    • Per Channel Mute and Enable
    • Software Shutdown
    • Multi-Mode Support: Stereo HP, Dual Mono
      HP, and Single-Channel BTL Operation
    • Amplifier Status
  • Space Saving Packages
    • 20 Pin, 4 mm × 4 mm QFN
    • 16 ball, 2 mm × 2 mm DSBGA
  • ESD Protection of 8 kV HBM and IEC Contact

The TPA6130A2 is a stereo DirectPath™ headphone amplifier with I2C digital volume control. The TPA6130A2 has minimal quiescent current consumption, with a typical IDD of 4 mA, making it optimal for portable applications. The I2C control allows maximum flexibility with a 64 step audio taper volume control, channel independent enables and mutes, and the ability to configure the outputs into stereo, dual mono, or a single receiver speaker BTL amplifier that drives 300 mW of power into 16 Ω loads.

The TPA6130A2 is a high fidelity amplifier with an SNR of 98 dB. A PSRR greater than 100 dB enables direct-to-battery connections without compromising the listening experience. The output noise of 9 µVrms (typical A-weighted) provides a minimal noise background during periods of silence. Configurable differential inputs and high CMRR allow for maximum noise rejection in the noisy environment of a mobile device.

TPA6130A2 packaging includes a 2 by 2 mm chip-scale package, and a 4 by 4 mm QFN package.

The TPA6130A2 is a stereo DirectPath™ headphone amplifier with I2C digital volume control. The TPA6130A2 has minimal quiescent current consumption, with a typical IDD of 4 mA, making it optimal for portable applications. The I2C control allows maximum flexibility with a 64 step audio taper volume control, channel independent enables and mutes, and the ability to configure the outputs into stereo, dual mono, or a single receiver speaker BTL amplifier that drives 300 mW of power into 16 Ω loads.

The TPA6130A2 is a high fidelity amplifier with an SNR of 98 dB. A PSRR greater than 100 dB enables direct-to-battery connections without compromising the listening experience. The output noise of 9 µVrms (typical A-weighted) provides a minimal noise background during periods of silence. Configurable differential inputs and high CMRR allow for maximum noise rejection in the noisy environment of a mobile device.

TPA6130A2 packaging includes a 2 by 2 mm chip-scale package, and a 4 by 4 mm QFN package.

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类型 标题 下载最新的英语版本 日期
* 数据表 TPA6130A2 138-mW DIRECTPATH™ Stereo Headphone Amplifier with I2C Volume Control 数据表 (Rev. F) PDF | HTML 2015年 4月 4日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
EVM 用户指南 TPA6130A2EVM - User Guide (Rev. A) 2014年 9月 22日
模拟设计期刊 用于将 APA 输出连接至其它器件的预防措施 英语版 2011年 4月 5日
模拟设计期刊 2Q 2010 Issue Analog Applications Journal 2010年 5月 6日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

TPA6130A2EVM — TPA6130A2 评估模块 (EVM)

The TPA6130A2EVM allows the engineer to evaluate the TPA6130A2, a stereo DirectPath™ (capacitor-free) headphone amplifier with I²C digital volume control. The TPA6130A2 has minimal quiescent current consumption, a flexible, 64-step, audio tapered volume control and channel independent (...)

用户指南: PDF
TI.com 上无现货
驱动程序或库

TPA6130A2SW-LINUX — 适用于 TPA6130A2 的 Linux 驱动程序

Linux 驱动程序支持 TPA61x0A2 系列立体声耳机放大器。Linux 驱动程序支持通过 I2C 总线和接口与 Linux DAPM(便携式设备动态音频电源管理)系统进行通信。
Linux 主线状态

在 Linux 主线中提供:是
可通过 git.ti.com 获取:不适用

支持的器件:
  • tpa6130a2
  • tpa6140a2
Linux 源文件

与该器件关联的文件为:

  1. sound/soc/codecs/tpa6130a2.c
  2. Documentation/devicetree/bindings/sound/tpa6130a2.txt
  3. sound/soc/codecs/tpa6130a2.h
  4. (...)
评估模块 (EVM) 用 GUI

SLOC235 TPA6130A2 GUI installation package

支持的产品和硬件

支持的产品和硬件

产品
耳机放大器
TPA6130A2 具有 I2C 控制接口的 138mW 立体声模拟输入耳机放大器
模拟工具

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PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。 

在 PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
封装 引脚 CAD 符号、封装和 3D 模型
DSBGA (YZH) 16 Ultra Librarian
WQFN (RTJ) 20 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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