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TPA2005D1

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关断引脚兼容 1.8V 逻辑电平的 1.4W 单声道、模拟输入 D 类扬声器放大器

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TPA2005D1

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产品详情

Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 1.4 SNR (dB) 97 THD + N at 1 kHz (%) 0.2 Iq (typ) (mA) 2.8 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-D Speaker channels (max) Mono Rating Catalog Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 Load (min) (Ω) 8 Output power (W) 1.4 SNR (dB) 97 THD + N at 1 kHz (%) 0.2 Iq (typ) (mA) 2.8 Control interface Hardware Closed/open loop Closed Analog supply (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 PSRR (dB) 75 Operating temperature range (°C) -40 to 85
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 VSON (DRB) 8 9 mm² 3 x 3
  • 1.4 W Into 8 Ω From a 5 V Supply at THD = 10% (Typ)
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-Ω Speaker:
      • 84% at 400 mW
      • 79% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-μA Shutdown Current
  • Capable of Driving an 8-Ω Speaker (2.5 V ≤ VDD ≤ 5.5 V) and a 4-Ω Speaker (2.5 V ≤ VDD ≤ 4.2 V)
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Internally Generated 250-kHz Switching Frequency Eliminates Capacitor & Resistor
    • Improved PSRR (–71 dB at 217 Hz) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification & Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Space Saving Package
    • 3 mm × 3 mm QFN package (DRB)
    • 2.5 mm × 2.5 mm MicroStar Junior BGA Package (ZQY)
    • 3 mm x 5 mm MSOP PowerPAD Package (DGN)
  • Use TPA2006D1 for 1.8 V Logic Compatibility on Shutdown Pin

All trademarks are the property of their respective owners.

  • 1.4 W Into 8 Ω From a 5 V Supply at THD = 10% (Typ)
  • Maximum Battery Life and Minimum Heat
    • Efficiency With an 8-Ω Speaker:
      • 84% at 400 mW
      • 79% at 100 mW
    • 2.8-mA Quiescent Current
    • 0.5-μA Shutdown Current
  • Capable of Driving an 8-Ω Speaker (2.5 V ≤ VDD ≤ 5.5 V) and a 4-Ω Speaker (2.5 V ≤ VDD ≤ 4.2 V)
  • Only Three External Components
    • Optimized PWM Output Stage Eliminates LC Output Filter
    • Internally Generated 250-kHz Switching Frequency Eliminates Capacitor & Resistor
    • Improved PSRR (–71 dB at 217 Hz) and Wide Supply Voltage (2.5 V to 5.5 V) Eliminates Need for a Voltage Regulator
    • Fully Differential Design Reduces RF Rectification & Eliminates Bypass Capacitor
    • Improved CMRR Eliminates Two Input Coupling Capacitors
  • Space Saving Package
    • 3 mm × 3 mm QFN package (DRB)
    • 2.5 mm × 2.5 mm MicroStar Junior BGA Package (ZQY)
    • 3 mm x 5 mm MSOP PowerPAD Package (DGN)
  • Use TPA2006D1 for 1.8 V Logic Compatibility on Shutdown Pin

All trademarks are the property of their respective owners.

The TPA2005D1 is a 1.4-W high efficiency filter-free class-D audio power amplifier in a MicroStar Junior™ BGA, QFN, or MSOP package that requires only three external components.

Features like 84% efficiency, –71-dB PSRR
at 217 Hz, improved RF-rectification immunity, and
15 mm2 total PCB area make the TPA2005D1 ideal for cellular handsets. A fast start-up time of 9 ms with minimal pop makes the TPA2005D1 ideal for PDA applications.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2005D1. The device allows independent gain control by summing the signals from each function while minimizing noise to only 48 μVRMS.

The TPA2005D1 has short-circuit and thermal protection.

The TPA2005D1 is a 1.4-W high efficiency filter-free class-D audio power amplifier in a MicroStar Junior™ BGA, QFN, or MSOP package that requires only three external components.

Features like 84% efficiency, –71-dB PSRR
at 217 Hz, improved RF-rectification immunity, and
15 mm2 total PCB area make the TPA2005D1 ideal for cellular handsets. A fast start-up time of 9 ms with minimal pop makes the TPA2005D1 ideal for PDA applications.

In cellular handsets, the earpiece, speaker phone, and melody ringer can each be driven by the TPA2005D1. The device allows independent gain control by summing the signals from each function while minimizing noise to only 48 μVRMS.

The TPA2005D1 has short-circuit and thermal protection.

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类型 标题 下载最新的英语版本 日期
* 数据表 TPA2005D1 1.4-W MONO Filter-Free Class-D Audio Power Amplifier 数据表 (Rev. G) PDF | HTML 2015年 10月 27日
应用手册 Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 2019年 8月 26日
应用手册 AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 2019年 6月 27日
应用手册 AN-1737 Managing EMI in Class D Audio Applications (Rev. A) 2013年 5月 1日
应用手册 Measuring Class-D Amplifiers for Audio Speaker Overstress Testing 2005年 10月 28日
应用手册 Power Rating in Audio Amplifier (Rev. A) 2005年 3月 4日
用户指南 TPA2005D1EVM - User Guide 2002年 6月 27日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

评估板

TPA2005D1EVM — TPA2005D1 评估模块 (EVM)

The TPA2005D1 is a 1-W high efficiency filter-free class-D audio power amplifier in a MicroStar™ BGA package that requires only three external components. It is ideal for small battery operated electronics including wireless or cellular handsets, personal digitalassistants (PDAs), and voice (...)

用户指南: PDF
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仿真模型

TPA2005D1 PSpice Transient Model (Rev. A)

SLOM184A.ZIP (84 KB) - PSpice Model
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仿真模型

TPA2005D1 TINA-TI Transient Reference Design

SLOM186.TSC (26 KB) - TINA-TI Reference Design
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仿真模型

TPA2005D1 TINA-TI Transient Spice Model

SLOM185.ZIP (17 KB) - TINA-TI Spice Model
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模拟工具

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

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在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
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参考设计

TIDA-010040 — 警报音发生器参考设计

此参考设计提供了一种产生类似于 IEC60601-1-8 医疗设备标准中所述的警报的方法。关键时序参数可通过固件进行编程。所有参数（包括脉宽、脉率、内部频率、脉冲上升时间、音量控制以及优先级）都可以使用固件进行控制。模拟包络由 MSP430FR2311 和模拟电路组合而成。
设计指南: PDF
原理图: PDF
封装 引脚 下载
HVSSOP (DGN) 8 查看选项
VSON (DRB) 8 查看选项
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订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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