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OPA2992 正在供货 双通道 40V、10.6MHz、轨到轨输入和输出低失调电压低噪声运算放大器 Rail-to-rail I/O, higher GBW (10.6 MHz), lower offset voltage (1 mV), lower power (2.4 mA), lower noise (7 nV/√Hz), higher output current (65 mA), wider temp range (-40 to 125)

产品详情

Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 44 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4 Rail-to-rail In to V- GBW (typ) (MHz) 6 Slew rate (typ) (V/µs) 45 Vos (offset voltage at 25°C) (max) (mV) 1.2 Iq per channel (typ) (mA) 3.45 Vn at 1 kHz (typ) (nV√Hz) 10.5 Rating Catalog Operating temperature range (°C) -40 to 105 Offset drift (typ) (µV/°C) 1.7 Features High Cload Drive Input bias current (max) (pA) 1500000 CMRR (typ) (dB) 108 Iout (typ) (A) 0.031 Architecture Bipolar Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -1.8 Output swing headroom (to negative supply) (typ) (V) 0.1 Output swing headroom (to positive supply) (typ) (V) -0.8
Number of channels 2 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 44 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 4 Rail-to-rail In to V- GBW (typ) (MHz) 6 Slew rate (typ) (V/µs) 45 Vos (offset voltage at 25°C) (max) (mV) 1.2 Iq per channel (typ) (mA) 3.45 Vn at 1 kHz (typ) (nV√Hz) 10.5 Rating Catalog Operating temperature range (°C) -40 to 105 Offset drift (typ) (µV/°C) 1.7 Features High Cload Drive Input bias current (max) (pA) 1500000 CMRR (typ) (dB) 108 Iout (typ) (A) 0.031 Architecture Bipolar Input common mode headroom (to negative supply) (typ) (V) -0.3 Input common mode headroom (to positive supply) (typ) (V) -1.8 Output swing headroom (to negative supply) (typ) (V) 0.1 Output swing headroom (to positive supply) (typ) (V) -0.8
TSSOP (PW) 16 32 mm² (5 mm × 6.4 mm) SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm) PDIP (P) 8 92.5083 mm² (9.81 mm × 9.43 mm)
  • Low noise
    • 10Hz . . . 15nV/√ Hz
    • 1kHz . . . 10.5nV/√ Hz
  • Load capability: 10000pF
  • Short-circuit output current: 20mA (minimum)
  • Slew rate: 27V/µs (minimum)
  • High gain-bandwidth product: 5.9MHz
  • Low VIO: 500µV maximum at 25°C
  • Single or split supply: 4V to 44V
  • Fast settling time:
    • 340ns to 0.1%
    • 400ns to 0.01%
  • Saturation recovery: 150ns
  • Large output swing:
    • VCC− + 0.1V to VCC+ − 1V
  • Low noise
    • 10Hz . . . 15nV/√ Hz
    • 1kHz . . . 10.5nV/√ Hz
  • Load capability: 10000pF
  • Short-circuit output current: 20mA (minimum)
  • Slew rate: 27V/µs (minimum)
  • High gain-bandwidth product: 5.9MHz
  • Low VIO: 500µV maximum at 25°C
  • Single or split supply: 4V to 44V
  • Fast settling time:
    • 340ns to 0.1%
    • 400ns to 0.01%
  • Saturation recovery: 150ns
  • Large output swing:
    • VCC− + 0.1V to VCC+ − 1V

The TLE214x and TLE214xA devices are high-performance, internally compensated operational amplifiers built using Texas Instruments complementary bipolar Excalibur process. The TLE214xA is a tighter offset voltage grade of the TLE214x. Both are pin-compatible upgrades to standard industry products.

The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5nV/√ Hz with a 10Hz 1/f corner and symmetrical 40V/µs slew rate typically with loads up to 800pF. The resulting low distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of 430ns to 0.1% of a 10V step with a 2kΩ/100pF load is useful in fast actuator/positioning drivers. Under similar test conditions, settling time to 0.01% is 640ns.

Both versions can also be used as comparators. Differential inputs of VCC± can be maintained without damage to the device. Open-loop propagation delay with TTL supply levels is typically 200ns. This gives a good indication as to output stage saturation recovery when the device is driven beyond the limits of recommended output swing.

Both the TLE214x and TLE214xA are available in a wide variety of packages, including both the industry-standard 8-pin small-outline version and chip form for high-density system applications. The C-suffix devices are characterized for operation from 0°C to 70°C, I-suffix devices from −40°C to 105°C, and M-suffix devices over the full military temperature range of −55°C to 125°C.

The TLE214x and TLE214xA devices are high-performance, internally compensated operational amplifiers built using Texas Instruments complementary bipolar Excalibur process. The TLE214xA is a tighter offset voltage grade of the TLE214x. Both are pin-compatible upgrades to standard industry products.

The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5nV/√ Hz with a 10Hz 1/f corner and symmetrical 40V/µs slew rate typically with loads up to 800pF. The resulting low distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of 430ns to 0.1% of a 10V step with a 2kΩ/100pF load is useful in fast actuator/positioning drivers. Under similar test conditions, settling time to 0.01% is 640ns.

Both versions can also be used as comparators. Differential inputs of VCC± can be maintained without damage to the device. Open-loop propagation delay with TTL supply levels is typically 200ns. This gives a good indication as to output stage saturation recovery when the device is driven beyond the limits of recommended output swing.

Both the TLE214x and TLE214xA are available in a wide variety of packages, including both the industry-standard 8-pin small-outline version and chip form for high-density system applications. The C-suffix devices are characterized for operation from 0°C to 70°C, I-suffix devices from −40°C to 105°C, and M-suffix devices over the full military temperature range of −55°C to 125°C.

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
电子书 The Signal e-book: 有关运算放大器设计主题的博客文章汇编 PDF | HTML 英语版 PDF | HTML 2018-1-31
应用手册 TLE2141 and TLE2141-Q1 EMI Immunity Performance (Rev. B) 2015-7-1
应用手册 Bipolar Voltage Outputs for the TLV56xx Family of DACs (Rev. A) 2015-5-18

设计与开发

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评估板

AMP-PDK-EVM — 放大器高性能开发套件评估模块

放大器高性能开发套件 (PDK) 是一款用于测试常见运算放大器参数的评估模块 (EVM) 套件,与大多数运算放大器和比较器均兼容。该 EVM 套件提供了一个主板,主板上具有多个插槽式子卡选项以满足封装需求,使工程师能够快速评估和验证器件性能。

AMP-PDK-EVM 套件支持五种常用的业界通用封装,包括:

  • D(SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV(SOT23-5 和 SOT23-6)
  • DCK(SC70-5 和 SC70-6)
用户指南: PDF | HTML
支持的产品和硬件
仿真模型

TLE2141 PSpice Model (Rev. A)

SLOM459A.ZIP (14 KB) - PSpice 模型
支持的产品和硬件
仿真模型

TLE2141 TINA-TI Reference Design (Rev. B)

SLOM457B (296 KB) - TINA-TI 参考设计
支持的产品和硬件
仿真模型

TLE2141 TINA-TI Spice Model (Rev. B)

SLOM458B.ZIP (11 KB) - TINA-TI Spice 模型
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
TSSOP (PW) 16 Ultra Librarian
SOIC (D) 8 Ultra Librarian
PDIP (P) 8 Ultra Librarian

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