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高速运算放大器 (GBW ≥ 50MHz)

THS4081

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175MHz 低功耗电压反馈放大器

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数据表

THS4081

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数据表 立即订购

产品详情

Architecture Voltage FB Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 10 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 30 GBW (typ) (MHz) 95 BW at Acl (MHz) 175 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 230 Vn at flatband (typ) (nV√Hz) 10.2 Vn at 1 kHz (typ) (nV√Hz) 10 Iq per channel (typ) (mA) 3.4 Vos (offset voltage at 25°C) (max) (mV) 7 Rail-to-rail No Rating Catalog Operating temperature range (°C) -40 to 85 CMRR (typ) (dB) 90 Input bias current (max) (pA) 6000000 Offset drift (typ) (µV/°C) 15 Iout (typ) (mA) 85 2nd harmonic (dBc) 79 3rd harmonic (dBc) 79 Frequency of harmonic distortion measurement (MHz) 1
Architecture Voltage FB Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 10 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 30 GBW (typ) (MHz) 95 BW at Acl (MHz) 175 Acl, min spec gain (V/V) 1 Slew rate (typ) (V/µs) 230 Vn at flatband (typ) (nV√Hz) 10.2 Vn at 1 kHz (typ) (nV√Hz) 10 Iq per channel (typ) (mA) 3.4 Vos (offset voltage at 25°C) (max) (mV) 7 Rail-to-rail No Rating Catalog Operating temperature range (°C) -40 to 85 CMRR (typ) (dB) 90 Input bias current (max) (pA) 6000000 Offset drift (typ) (µV/°C) 15 Iout (typ) (mA) 85 2nd harmonic (dBc) 79 3rd harmonic (dBc) 79 Frequency of harmonic distortion measurement (MHz) 1
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Ultralow 3.4 mA Per Channel Quiescent Current
  • High Speed
    • 175 MHz Bandwidth (\x963 dB, G = 1)
    • 230 V/us Slew Rate
    • 43 ns Settling Time (0.1%)
  • High Output Drive, IO = 85 mA (typ)
  • Excellent Video Performance
    • 35 MHz Bandwidth (0.1 dB, G = 1)
    • 0.01% Differential Gain
    • 0.05° Differential Phase
  • Very Low Distortion
    • THD = \x9664 dBc (f = 1 MHz, RL = 150 )
    • THD = \x9679 dBc (f = 1 MHz, RL = 1 k)
  • Wide Range of Power Supplies
    • VCC = ±5 V to ±15 V
  • Available in Standard SOIC or MSOP PowerPAD™ Package
  • Evaluation Module Available

PowerPAD is a trademark of Texas Instruments.
  • Ultralow 3.4 mA Per Channel Quiescent Current
  • High Speed
    • 175 MHz Bandwidth (\x963 dB, G = 1)
    • 230 V/us Slew Rate
    • 43 ns Settling Time (0.1%)
  • High Output Drive, IO = 85 mA (typ)
  • Excellent Video Performance
    • 35 MHz Bandwidth (0.1 dB, G = 1)
    • 0.01% Differential Gain
    • 0.05° Differential Phase
  • Very Low Distortion
    • THD = \x9664 dBc (f = 1 MHz, RL = 150 )
    • THD = \x9679 dBc (f = 1 MHz, RL = 1 k)
  • Wide Range of Power Supplies
    • VCC = ±5 V to ±15 V
  • Available in Standard SOIC or MSOP PowerPAD™ Package
  • Evaluation Module Available

PowerPAD is a trademark of Texas Instruments.

The THS4081 and THS4082 are ultralow-power, high-speed voltage feedback amplifiers that are ideal for communication and video applications. These amplifiers operate off of a very low 3.4-mA quiescent current per channel and have a high output drive capability of 85 mA. The signal-amplifier THS4081 and the dual-amplifier THS4082 offer very good ac performance with 175-MHz bandwidth, 230-V/us slew rate, and 43-ns settling time (0.1%). With total harmonic distortion (THD) of \x9664 dBc at f = 1 MHz, the THS4081 and THS4082 are ideally suited for applications requiring low distortion.

The THS4081 and THS4082 are ultralow-power, high-speed voltage feedback amplifiers that are ideal for communication and video applications. These amplifiers operate off of a very low 3.4-mA quiescent current per channel and have a high output drive capability of 85 mA. The signal-amplifier THS4081 and the dual-amplifier THS4082 offer very good ac performance with 175-MHz bandwidth, 230-V/us slew rate, and 43-ns settling time (0.1%). With total harmonic distortion (THD) of \x9664 dBc at f = 1 MHz, the THS4081 and THS4082 are ideally suited for applications requiring low distortion.
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类型 标题 下载最新的英语版本 日期
* 数据表 175-MHz Low-Power High-Speed Amplifiers 数据表 (Rev. D) 2001年 6月 25日

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包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

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