产品详细信息

Configuration 1:1 SPST Number of channels (#) 1 Power supply voltage - single (V) 0.8, 1.2, 1.8, 2.5 Protocols Analog Ron (Typ) (Ohms) 10 CON (Typ) (pF) 7 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 50 Rating Catalog
Configuration 1:1 SPST Number of channels (#) 1 Power supply voltage - single (V) 0.8, 1.2, 1.8, 2.5 Protocols Analog Ron (Typ) (Ohms) 10 CON (Typ) (pF) 7 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Input/output continuous current (Max) (mA) 50 Rating Catalog
DSBGA (YZP) 5 2 mm² .928 x 1.428 SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 5 4 mm² 2 x 2.1
  • Available in the Texas Instruments NanoFree™ Package
  • Wide VCC Range of 0.8 V to 2.7 V
  • Sub-1-V Operable
  • Low Power Consumption, 10-µA Max ICC
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed – Max 0.2 ns
    (VCC = 1.8 V, CL = 15 pF)
  • Low On-State Impedance – Typically 9
    (VCC = 2.3 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments.

  • Available in the Texas Instruments NanoFree™ Package
  • Wide VCC Range of 0.8 V to 2.7 V
  • Sub-1-V Operable
  • Low Power Consumption, 10-µA Max ICC
  • High On-Off Output Voltage Ratio
  • High Degree of Linearity
  • High Speed – Max 0.2 ns
    (VCC = 1.8 V, CL = 15 pF)
  • Low On-State Impedance – Typically 9
    (VCC = 2.3 V)
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree Is a trademark of Texas Instruments.

This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCC and GND for it to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

This single analog switch is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G66 can handle both analog and digital signals. The combined AC and DC signal has to be between VCC and GND for it to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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技术文档

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类型 项目标题 下载最新的英语版本 日期
* 数据表 Single Bilateral Analog Switch 数据表 (Rev. L) 10 Aug 2009
应用手册 选择正确的德州仪器 (TI) 信号开关 (Rev. E) PDF | HTML 下载英文版本 (Rev.E) PDF | HTML 05 Aug 2022
应用手册 多路复用器和信号开关词汇表 (Rev. B) 下载英文版本 (Rev.B) PDF | HTML 11 Mar 2022
选择指南 Little Logic Guide 2014 (Rev. G) 06 Jul 2018
选择指南 Logic Guide (Rev. AB) 12 Jun 2017
应用手册 How to Select Little Logic (Rev. A) 26 Jul 2016
应用手册 Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
选择指南 逻辑器件指南 2014 (Rev. AA) 下载最新的英文版本 (Rev.AB) 17 Nov 2014
选择指南 小尺寸逻辑器件指南 (Rev. E) 下载最新的英文版本 (Rev.G) 16 Jul 2012
用户指南 LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
应用手册 选择正确的电平转换解决方案 (Rev. A) 下载英文版本 (Rev.A) 23 Mar 2006
更多文献资料 Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
应用手册 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
用户指南 Signal Switch Data Book (Rev. A) 14 Nov 2003
更多文献资料 Logic Cross-Reference (Rev. A) 07 Oct 2003
应用手册 Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 Mar 2003
用户指南 AUC Data Book, January 2003 (Rev. A) 01 Jan 2003
应用手册 Texas Instruments Little Logic Application Report 01 Nov 2002
应用手册 TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
更多文献资料 Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
更多文献资料 STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
更多文献资料 AUC Product Brochure (Rev. A) 18 Mar 2002

设计和开发

如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。

评估板

DIP-ADAPTER-EVM — DIP 适配器评估模块

借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。

DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:

  • D 和 U (SOIC-8)
  • PW (TSSOP-8)
  • DGK(MSOP-8、VSSOP-8)
  • DBV(SOT23-6、SOT23-5 和 SOT23-3)
  • DCK(SC70-6 和 SC70-5)
  • DRL (SOT563-6)
用户指南: PDF
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接口适配器

LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器

EVM-LEADLESS1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面贴装封装转换为 100mil DIP 接头。
TI.com 無法提供
仿真模型

HSPICE Model of SN74AUC1G66

SCEJ181.ZIP (89 KB) - HSpice Model
仿真模型

SN74AUC1G66 IBIS Model

SCEM337.ZIP (50 KB) - IBIS Model
仿真模型

SN74AUC1G66 PSpice Model

SCEM586.ZIP (1 KB) - PSpice Model
封装 引脚数 下载
DSBGA (YZP) 5 了解详情
SC70 (DCK) 5 了解详情
SOT-23 (DBV) 5 了解详情

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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