产品详情

Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
Sensor resolution 80 x 60 Pixel pitch (µm) 30 Type System-on-Chip (SoC) Interface type CMOS Parallel Interface, DVP, SSI Output format Depth Data Frame rate (max) (FPS) 1000 Operating temperature range (°C) 0 to 70 Rating Catalog
COG (NBP) 56 42.88726 mm² 5.321 x 8.06
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C
  • Imaging Array:
    • 80 × 60 Array
    • 1/6” Sensor Format
    • Pixel Pitch: 30 µm
    • Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
  • Optical Properties:
    • Responsivity: 0.35 A/W at 850 nm
    • Demodulation Contrast: 70% at 50 MHz
    • Demodulation Frequency: 10 MHz to 100 MHz
  • Output Interface:
    • Digital Video Port (DVP): 8 Data Lanes,
      HD and VD Pins, and Clock
    • Synchronous Serial Interface (SSI):
      1 Data Lane, Clock, and Chip Select
  • Timing Generator:
    • Sensor Addressing Engine
    • Modulation Control
    • De-Aliasing
    • Master, Slave Sync Operation
    • High Dynamic Range Operation
  • Depth Engine:
    • Pixel Binning
    • De-Aliasing
    • Histogram
    • Calibration
  • Power Supply:
    • 3.3-V I/O, Analog
    • 1.8-V Analog, Digital, I/O
    • 1.8-V Demodulation (Typical)
  • Optimized Optical Package (COG-56):
    • 8.03 mm × 5.32 mm × 0.745 mm
    • Integrated Optical Band-Pass Filter
      (830 nm to 867 nm)
    • Optical Fiducials for Easy Alignment
  • Built-In Illumination Driver for Low-Power Applications
  • Operating Temperature: 0°C to 70°C

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.

The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

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技术文档

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类型 标题 下载最新的英语版本 日期
* 数据表 OPT8320 3D 飞行时间传感器(短) 数据表 2018年 4月 24日
电子书 电子书:工业机器人设计工程师指南 下载英文版本 2020年 3月 25日
电子书 E-book: An engineer’s guide to industrial robot designs.. 2020年 3月 25日
EVM 用户指南 OPT8320-CDK-EVM User's Guide (Rev. A) 2017年 2月 2日
应用手册 Sensor Optics Selection Guide for 3D ToF Camera Systems PDF | HTML 2016年 7月 22日
白皮书 Filtering for 3D Time-of-Flight Sensors 2016年 1月 21日
设计指南 Introduction to Time-of-Flight (ToF) System Design (Rev. D) 2014年 5月 13日
白皮书 Introduction to Time-of-Flight Camera (Rev. B) 2014年 5月 7日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日

设计和开发

如需其他信息或资源,请查看下方列表,点击标题即可进入详情页面。

仿真模型

OPT8320 IBIS Model

SBAM256.ZIP (88 KB) - IBIS Model
计算工具

SBAC124 3D ToF System Estimator Tool

lock = 需要出口许可(1 分钟)
支持的产品和硬件

支持的产品和硬件

产品
飞行时间 (ToF) 传感器
OPT8241 QVGA 分辨率 3D 飞行时间 (ToF) 传感器 OPT8320 3D 飞行时间 (ToF) 传感器和控制器 OPT9221 适用于 OPT8241 的飞行时间 (ToF) 控制器
封装 引脚数 下载
COG (NBP) 56 了解详情

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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