CSD95481RWJ

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采用行业标准封装的 60A 同步降压 NexFET™ 智能功率级

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CSD95411 正在供货 65A 峰值连续电流同步降压 NexFET™ 功率级 Improved device current rating and efficiency

产品详情

VDS (V) 20 Power loss (W) 2.7 Ploss current (A) 30 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 60 Operating temperature range (°C) -55 to 150 Features Analog temperature output, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Ultra-low inductance package Rating Catalog
VDS (V) 20 Power loss (W) 2.7 Ploss current (A) 30 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 60 Operating temperature range (°C) -55 to 150 Features Analog temperature output, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Ultra-low inductance package Rating Catalog
VQFN-CLIP (RWJ) 41 30 mm² 6 x 5
  • 60-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 60-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


The CSD95481RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


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CSD95480RWJ 正在供货 采用行业标准封装的 70A 同步降压 NexFET™ 智能功率级 Slightly better efficiency

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类型 标题 下载最新的英语版本 日期
* 数据表 CSD95481RWJ Synchronous Buck NexFET Smart Power Stage 数据表 PDF | HTML 2017年 6月 16日

设计和开发

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仿真模型

CSD95481RWJ PSpice Transient Model (Rev. A)

SLPM191A.ZIP (24 KB) - PSpice Model
封装 引脚 下载
VQFN-CLIP (RWJ) 41 查看选项

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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