BUF11702
- Gamma Correction Channels: 10, 6
- Integrated VCOM Buffer
- Excellent Output Current Drive:
- Gamma Channels: > 30mA at 0.5V Swing to Rails(1)
- VCOM: > 150mA at 5V Swing to Rails(1)
- Large Capacitive Load Drive Capability
- Rail-to-Rail Output
- PowerPAD Package
- Low-Power/Channel: < 340µA
- Wide Supply Range: 4.5V to 16V
- Specified for 0°C to 85°C
- High ESD Rating: 4kV
(1) See typical characteristic curves for detail.
PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
The BUFxx702 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a VCOM channel with higher current drive capability is integrated in the BUF11702 and BUF07702.
The various buffers within the BUFxx702 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The VCOM channel has increased output drive of > 100mA and can handle even larger capacitive loads.
The BUF07702 and BUF11702 is available in the TSSOP-PowerPAD. package for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package.
A flow-through pinout has been adopted to allow simple PCB routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx702 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 4kV (HBM) as tested under MIL-STD-883C Method 3015.
技术文档
| 类型 | 标题 | 下载最新的英语版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 数据表 | BUF11702, BUF07702: Multi-Channel LCD Gamma Correction Buffer 数据表 (Rev. F) | 2004年 5月 24日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点