BUF07704
- Wide Supply Range: 4.5 V to 18 V
- Gamma Correction Channels: 10, 6, and 4
- Integrated VCOM Buffer
- Excellent Output Current Drive:
- Gamma Channels:
> 30 mA at 0.5 V Swing to Rails(1) - VCOM:
> 100 mA typ at 2 V Swing to Rails(1)
- Gamma Channels:
- Large Capacitive Load Drive Capability
- Rail-to-Rail Output
- PowerPAD™ Package
- Low-Power/Channel: < 500 µA
- High ESD Rating: 8 kV HBM, 2 kV CDM, 300 V MM
- Specified for –25°C to +85°C
(1) See Typical Characteristic curves for details.
PowerPAD is a trademark of Texas Instruments Incorporated.
All other trademarks are the property of their respective owners.
The BUFxx704 are a series of multi-channel buffers targeted towards gamma correction in high-resolution LCD panels. They are pin-compatible with the existing BUFxx702 and BUFxx703 families and operate at higher supply voltages up to 18 V (19 V absolute max). The higher supply voltage enables faster response times and brighter images in large-screen LCD panels. This is especially important in LCD TV applications.
The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, 10, 6, and 4 channel options are offered. For additional space and cost savings, a VCOM channel with > 100mA drive capability is integrated into the BUF11704, BUF07704, and BUF05704.
The BUF11704, BUF07704, BUF06704, and BUF05704 are available in the TSSOP-28, TSSOP-20, TSSOP-16, and TSSOP-14 PowerPAD packages for dramatically increased power dissipation capability. This way, a large number of channels can be handled safely in one package.
A flow-through pinout has been adopted to allow simple PCB routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx704 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 8 kV (HBM), 2 kV (CDM), and 300 V (MM).
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | BUFxx704: 18-V Supply Multi-Channel Gamma Correction Buffer 数据表 (Rev. F) | 2007年 12月 5日 | |||
应用手册 | Driving Capacitive Loads with Gamma Buffers | 2012年 11月 20日 | ||||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HTSSOP (PWP) | 20 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点