BUF05703
- Gamma Correction Channels: 6, 4
- Integrated VCOM Buffer
- Excellent Output Current Drive:
- Gamma Channels: > 10mA
- VCOM: > 100mA typ
- Large Capacitive Load Drive Capability
- Rail-to-Rail Output
- PowerPAD™ Package: BUF07703
- Low-Power/Channel: < 250µA
- Wide Supply Range: 4.5V to 16V
- Specified for –40°C to 85°C
- High ESD Rating: 4kV HBM, 1.5kV CDM
- APPLICATIONS
- LCD Flat Panel Displays
- LCD Television Displays
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
The BUFxx703 are a series of multi-channel buffers targeted towards gamma correction in high-resolution liquid crystal display (LCD) panels. The number of gamma correction channels required depends on a variety of factors and differs greatly from design to design. Therefore, various channel options are offered. For additional space and cost savings, a VCOM channel with higher current drive capability is integrated in the BUF07703 and BUF05703.
A flow-through pinout has been adopted to allow simple printed circuit board (PCB) routing and maintain the cost-effectiveness of this solution. All inputs and outputs of the BUFxx703 incorporate internal ESD protection circuits that prevent functional failures at voltages up to 4kV HBM and 1.5kV CDM.
The various buffers within the BUFxx703 are carefully matched to the voltage I/O requirements for the gamma correction application. Each buffer is capable of driving heavy capacitive loads and offers fast load current switching. The VCOM channel has increased output drive of > 100mA and can handle even larger capacitive loads.
The BUF07703 is available in the HTSSOP PowerPAD™ package for dramatically increased power dissipation capability. The BUF06703 and BUF05703 are available in standard TSSOP-16 and TSSOP-14 packages.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | Multi-Channel LCD Gamma Correction Buffer 数据表 (Rev. C) | 2010年 4月 21日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点