441-pin (ALV) package image

AM6421BSEFHAALVR

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单核 64 位 Arm® Cortex®-A53,双核 Cortex-R5F,具有 PCIe、USB 3.0 和安全性 | ALV | 441 | -40 to 105

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质量信息

等级 Catalog
RoHS Yes
REACH Yes
MSL 等级/回流焊峰值温度 Level-3-250C-168 HR
质量、可靠性
和封装信息

包含信息:

  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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包含信息:

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出口管制分类

*仅供参考

  • 美国 ECCN:5A992C

封装信息

封装 | 引脚 FCBGA (ALV) | 441
工作温度范围 (°C) -40 to 105
包装数量 | 包装 500 | LARGE T&R

AM6421 的特性

Processor cores:

  • 1× Dual 64-bit Arm Cortex-A53 microprocessor subsystem at up to 1.0GHz
    • Dual-core Cortex-A53 cluster with 256KB L2 shared cache with SECDED ECC
    • Each A53 Core has 32KB L1 DCache with SECDED ECC and 32KB L1 ICache with Parity protection
  • Up to 2× Dual-core Arm Cortex-R5F MCU subsystems at up to 800MHz, integrated for real-time processing
    • Dual-core Arm Cortex-R5F supports dual-core and single-core modes
    • 32KB ICache, 32KB DCache and 64KB TCM per each R5F core for a total of 256KB TCM with SECDED ECC on all memories
  • 1× Single-core Arm Cortex-M4F MCU at up to 400MHz
    • 256KB SRAM with SECDED ECC

Industrial subsystem:

  • 2× gigabit Industrial Communication Subsystems (PRU_ICSSG)
    • Supports Profinet IRT, Profinet RT, EtherNet/IP, EtherCAT, Time-Sensitive Networking (TSN), and more
    • Backward compatibility with 10/100Mb PRU_ICSS
    • Each PRU_ICSSG contains:
      • 2× Ethernet ports
        • MII (10/100)
        • RGMII (10/100/1000)
      • 6 PRU RISC cores per PRU_ICSSG each core having:
        • Instruction RAM with ECC
        • Broadside RAM
        • Multiplier with optional accumulator (MAC)
        • CRC16/32 hardware accelerator
        • Byte swap for Big/Little Endian conversion
        • SUM32 hardware accelerator for UDP checksum
        • Task Manager for preemption support
      • Three Data RAMs with ECC
      • 8 banks of 30 × 32-bit register scratchpad memory
      • Interrupt controller and task manager
      • Two 64-bit Industrial Ethernet Peripherals (IEPs) for time stamping and other time synchronization functions
      • 18× Sigma-Delta filters
        • Short circuit logic
        • Over-current logic
      • 6× Multi-protocol position encoder interfaces
      • One Enhanced Capture Module (ECAP)
      • 16550-compatible UART with a dedicated 192MHz clock to support 12Mbps PROFIBUS

Memory subsystem:

  • Up to 2MB of On-chip RAM (OCSRAM) with SECDED ECC:
    • Can be divided into smaller banks in increments of 256KB for as many as 8 separate memory banks
    • Each memory bank can be allocated to a single core to facilitate software task partitioning
  • DDR Subsystem (DDRSS)
    • Supports LPDDR4, DDR4 memory types
    • 16-Bit data bus with inline ECC
    • Supports speeds up to 1600MT/s
  • 1× General-Purpose Memory Controller (GPMC)
    • 16-Bit parallel bus with 133MHz clock or
    • 32-Bit parallel bus with 100MHz clock
    • Error Location Module (ELM) support

System on Chip (SoC) Services:

  • Device Management Security Controller (DMSC-L)
    • Centralized SoC system controller
    • Manages system services including initial boot, security, and clock/reset/power management
    • Communication with various processing units over message manager
    • Simplified interface for optimizing unused peripherals
  • Data Movement Subsystem (DMSS)

    • Block Copy DMA (BCDMA)
    • Packet DMA (PKTDMA)
    • Secure Proxy (SEC_PROXY)
    • Ring Accelerator (RINGACC)

Security:

  • Secure boot supported
    • Hardware-enforced Root-of-Trust (RoT)
    • Support to switch RoT via backup key
    • Support for takeover protection, IP protection, and anti-roll back protection
  • Trusted Execution Environment (TEE) supported
    • Arm TrustZone based TEE
    • Secure watchdog/timer/IPC
    • Extensive firewall support for isolation
    • Secure storage support
    • Replay Protected Memory Block (RPMB) support
  • Security co-processor (DMSC-L) for key and security management, with dedicated device level interconnect for security
  • Cryptographic acceleration supported
    • Session-aware cryptographic engine with ability to auto-switch key-material based on incoming data stream
      • Supports cryptographic cores
    • AES – 128-/192-/256-Bit key sizes
    • SHA2 – 224-/256-/384-/512-Bit key sizes
    • DRBG with true random number generator
    • PKA (Public Key Accelerator) to Assist in RSA/ECC processing for secure boot
  • Debugging security
    • Secure software controlled debug access
    • Security aware debugging

High-speed interfaces:

  • 1× Integrated Ethernet switch (CPSW3G) supporting:
    • Up to 2 Ethernet ports
      • RMII (10/100)
      • RGMII (10/100/1000)
    • IEEE 1588 (2008 Annex D, Annex E, Annex F) with 802.1AS PTP
    • Clause 45 MDIO PHY management
    • Energy efficient Ethernet (802.3az)
  • 1× PCI-Express Gen2 controller (PCIE)
    • Supports Gen2 operation
    • Supports Single Lane operation
  • 1× USB 3.1 Dual-Role Device (DRD) Subsystem (USBSS)
    • Port configurable as USB host,USB device, orUSB Dual-Role device
    • USB device: High-speed (480Mbps), andFull-speed (12Mbps)
    • USB host: SuperSpeed Gen 1 (5Gbps),High-speed (480Mbps),Full-speed (12Mbps), andLow-speed (1.5Mbps)

General connectivity:

  • 6× Inter-Integrated Circuit (I2C) ports
  • 9× configurable Universal Asynchronous Receive/Transmit (UART) modules
  • 1× Flash Subsystem (FSS) that can be configured as Octal SPI (OSPI) flash interfaces or one Quad SPI (QSPI)
  • 1× 12-Bit Analog-to-Digital Converters (ADC)
    • Up to 4MSPS
    • 8× multiplexed analog inputs
  • 7× Multichannel Serial Peripheral Interfaces (MCSPI) controllers
  • 6× Fast Serial Interface Receiver (FSI_RX) cores
  • 2× Fast Serial Interface Transmitter (FSI_TX) cores
  • 3× General-Purpose I/O (GPIO) modules

Control interfaces:

  • 9× Enhanced Pulse-Width Modulator (EPWM) modules
  • 3× Enhanced Capture (ECAP) modules
  • 3× Enhanced Quadrature Encoder Pulse (EQEP) modules
  • 2× Modular Controller Area Network (MCAN) modules with or without full CAN-FD support

Media and data storage:

  • 2× Multi-Media Card/Secure Digital (MMC/SD/SDIO) interfaces
    • One 4-bit for SD/SDIO;
    • One 8-bit for eMMC
    • Integrated analog switch for voltage switching between 3.3V to 1.8V for high-speed cards

Power management:

  • Simplified power sequence
  • Integrated SDIO LDO for handling automatic voltage transition for SD interface
  • Integrated voltage supervisor for safety monitoring of over-under voltage conditions
  • Integrated power supply glitch detector for detecting fast supply transients

Functional Safety:

  • Functional Safety-Compliant
    • Developed for functional safety applications
    • Documentation available to aid IEC 61508 functional safety system design
    • Systematic capability up to SIL 3
    • Hardware integrity up to SIL 2
    • Safety-related certification
  • Functional Safety Features
    • ECC or parity on calculation-critical memories
    • ECC and parity on select internal bus interconnect
    • Built-In Self-Test (BIST) for CPU and on-chip RAM
    • Error Signaling Module (ESM) with error pin
    • Runtime safety diagnostics, voltage, temperature, and clock monitoring, windowed watchdog timers, CRC engine for memory integrity checks
    • Dedicated MCU domain memory, interfaces, and M4F core capable of being isolated from the larger SoC with Freedom From Interference (FFI) features
      • Separate interconnect
      • Firewalls and timeout gaskets
      • Dedicated PLL
      • Dedicated I/O supply
      • Separate reset

SoC architecture:

  • Supports primary boot from UART, I2C, OSPI/QSPI Flash, SPI Flash, parallel NOR Flash, parallel NAND Flash, SD, eMMC, USB, PCIe, and Ethernet interfaces
  • 16nm FinFET technology

Package options:

  • ALV: 17.2mm × 17.2mm, 0.8mm pitch, 441-pin BGA package
  • ANI: 17.2mm × 17.2mm, 0.8mm pitch, 441-pin BGA package

AM6421 的说明

AM64x is an extension of the Sitara™ Industrial-grade family of heterogeneous Arm® processors. AM64x is built for industrial applications, such as motor drives and Programmable Logic Controllers (PLCs), which require a unique combination of real-time processing and communications with applications processing. AM64x combines two instances of the Sitara device’s gigabit TSN-enabled PRU-ICSSG with up to two Arm® Cortex®-A53 cores, up to four Cortex-R5F MCUs, and a Cortex-M4F MCU.

AM64x is architected to provide real-time performance through the high-performance R5Fs, Tightly-Coupled Memory banks, configurable SRAM partitioning, and dedicated low-latency paths to and from peripherals for rapid data movement in and out of the SoC. This deterministic architecture allows for AM64x to handle the tight control loops found in servo drives while the peripherals like FSI, GPMC, PWMs, sigma delta decimation filters, and absolute encoder interfaces help enable a number of different architectures found in these systems.

The Cortex-A53s provide the powerful computing elements necessary for Linux applications. Linux, and Real-time (RT) Linux, is provided through TI’s Processor SDK Linux which stays updated to the latest Long Term Support (LTS) Linux kernel, bootloader and Yocto file system on an annual basis. AM64x helps bridge the Linux world with the real-time world by enabling isolation between Linux applications and real-time streams through configurable memory partitioning. The Cortex-A53s can be assigned to work strictly out of DDR for Linux, and the internal SRAM can be broken up into various sizes for the Cortex-R5Fs to use together or independently.

The AM64x provides flexible industrial communications capability including full protocol stacks for EtherCAT SubDevice, PROFINET device, EtherNet/IP adapter, and IO-Link Master. The PRU-ICSSG further provides capability for gigabit and TSN based protocols. In addition, the PRU-ICSSG also enables additional interfaces in the SoC including sigma delta decimation filters and absolute encoder interfaces.

Functional safety features can be enabled through the integrated Cortex-M4F along with dedicated peripherals which can all be isolated from the rest of the SoC. AM64x also supports secure boot.

  • 库存:
    限制: 此限制是为了保护样片库存以支持客户设计评估阶段使用,将会在库存充裕时取消此限制。
缺货
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包装类型

您可以根据器件数量选择不同的包装方式,包括完整卷带、定制卷带、剪切带、管装或托盘。

定制卷带是从整盘卷带上剪下来的具有连续长度的剪切带,是一种可以对特定数量提供产品批次及生产日期跟踪的包装方式。根据行业标准,使用黄铜垫片在剪切带两端各连接一个 18 英寸的引带和尾带,以直接送入自动组装机。涉及定制卷带的 TI 订单将包含卷带费用。

剪切带是从整盘卷带上剪下来的特定长度的编带。根据所申请器件数量的不同,TI 可能会使用多条剪切带或多个盒子进行包装。

TI 通常会根据库存情况选择将管装托盘器件以盒装或者管装或托盘形式发货。所有器件均会按照 TI 内部规定的静电放电和湿敏等级保护要求进行包装。

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