SLVSCA6C October   2013  – October 2017 TPS65311-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
      1. 7.8.1 BUCK 1 Characteristics
      2. 7.8.2 BUCK 2 and BUCK3 Characteristics
      3. 7.8.3 BOOST Characteristics
      4. 7.8.4 LDO Noise Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Buck Controller (BUCK1)
      2. 8.3.2  Synchronous Buck Converters BUCK2 and BUCK3
      3. 8.3.3  BOOST Converter
      4. 8.3.4  Frequency-Hopping Spread Spectrum
      5. 8.3.5  Linear Regulator LDO
      6. 8.3.6  Gate Driver Supply
      7. 8.3.7  RESET
      8. 8.3.8  Soft Start
      9. 8.3.9  Power-on Reset Flag
      10. 8.3.10 WAKE Pin
      11. 8.3.11 IRQ Pin
      12. 8.3.12 VBAT Undervoltage Warning
      13. 8.3.13 VIN Over or Undervoltage Protection
      14. 8.3.14 External Protection
      15. 8.3.15 Overtemperature Detection and Shutdown
      16. 8.3.16 Independent Voltage Monitoring
      17. 8.3.17 GND Loss Detection
      18. 8.3.18 Reference Voltage
      19. 8.3.19 Shutdown Comparator
      20. 8.3.20 LED and High-Side Switch Control
      21. 8.3.21 Window Watchdog
      22. 8.3.22 Timeout in Start-Up Modes
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
        1. 8.4.1.1  INIT
        2. 8.4.1.2  TESTSTART
        3. 8.4.1.3  TESTSTOP
        4. 8.4.1.4  VTCHECK
        5. 8.4.1.5  RAMP
          1. 8.4.1.5.1 Power-Up Sequencing
          2. 8.4.1.5.2 Power-Down Sequencing
        6. 8.4.1.6  ACTIVE
        7. 8.4.1.7  ERROR
        8. 8.4.1.8  LOCKED
        9. 8.4.1.9  LPM0
        10. 8.4.1.10 SHUTDOWN
    5. 8.5 Programming
      1. 8.5.1 SPI
        1. 8.5.1.1 FSI Bit
    6. 8.6 Register Map
      1. 8.6.1 Register Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Buck Controller (BUCK1)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Adjusting the Output Voltage for the BUCK1 Controller
          2. 9.2.1.2.2 Output Inductor, Sense Resistor, and Capacitor Selection for the BUCK1 Controller
          3. 9.2.1.2.3 Compensation of the Buck Controller
          4. 9.2.1.2.4 Bootstrap Capacitor for the BUCK1 Controller
        3. 9.2.1.3 BUCK 1 Application Curve
      2. 9.2.2 Synchronous Buck Converters BUCK2 and BUCK3
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Adjusting the Output Voltage for the BUCK2 and BUCK3 Converter
          2. 9.2.2.2.2 Output Inductor Selection for the BUCK2 and BUCK3 Converter
          3. 9.2.2.2.3 Compensation of the BUCK2 and BUCK3 Converters
          4. 9.2.2.2.4 Bootstrap Capacitor for the BUCK2/3 Converters
        3. 9.2.2.3 BUCK2 and BUCK3 Application Curves
      3. 9.2.3 BOOST Converter
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Adjusting the Output Voltage for the Boost Converter
          2. 9.2.3.2.2 Output Inductor and Capacitor Selection for the BOOST Converter
          3. 9.2.3.2.3 Compensation of the BOOST Converter
          4. 9.2.3.2.4 Output Diode for the BOOST Converter
        3. 9.2.3.3 BOOST Converter Application Curves
      4. 9.2.4 Linear Regulator
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 Adjusting the Output Voltage for the Linear Regulator
          2. 9.2.4.2.2 Output Capacitance for the Linear Regulator
        3. 9.2.4.3 Linear Regulator Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Buck Controller
      2. 11.1.2 Buck Converter
      3. 11.1.3 Boost Converter
      4. 11.1.4 Linear Regulator
      5. 11.1.5 Other Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Test Guidance With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature
    • Device HBM ESD Classification Level H1B
    • Device CDM ESD Classification Level C4B
  • Input Voltage Range: 4 V to 40 V, Transients up to 60 V; 80 V When Using External PMOS-FET
  • Single-Output Synchronous-Buck Controller
    • Peak Gate-Drive Current 0.6 A
    • 490-kHz Fixed Switching Frequency
    • Pseudo Random Frequency-Hopping Spread Spectrum or Triangular Mode
  • Dual-Synchronous Buck Converter
    • Designed for Output Currents up to 2 A
    • Out of Phase Switching
    • Switching Frequency: 2.45 MHz
  • Adjustable 350-mA Linear Regulator
  • Adjustable Asynchronous-Boost Converter
    • 1-A Integrated Switch
    • Switching Frequency: 2.45 MHz
  • Soft-Start Feature for All Regulator Outputs
  • Independent Voltage Monitoring
  • Undervoltage (UV) Detection and Overvoltage (OV) Protection
  • Short Circuit, Overcurrent, and Thermal Protection on all supply output rails
  • Serial-Peripheral Interface (SPI) for Control and Diagnostic
  • Integrated Window Watchdog (WD)
  • Reference Voltage Output
  • High-Side (HS) Driver for Use with External PMOS-FET for driving an LED
  • Input for External Temperature Sensor for Shutdown at TA < –40°C
  • Thermally Enhanced Packages With Exposed Thermal Pad
    • 56-Pin VQFN (RVJ) or 56-Pin VQFNP (RWE)

2 Applications

  • Multi-Rail DC Power Distribution Systems
  • Safety-Relevant Automotive Applications
    • Advanced Driver Assistance Systems

3 Description

The TPS65311-Q1 device is a power-management IC (PMIC), meeting the requirements of digital-signal-processor (DSP) controlled-automotive systems (for example, advanced driver-assistance systems). With the integration of commonly used supply rails and features, the TPS65311-Q1 device significantly reduces board space and system costs.

The device is capable of providing stable output voltages to the application, including a typical 5-V CAN-supply, from a varying input power supply (such as an automotive car battery) from 4 V to 40 V. The device includes one synchronous buck controller as a pre-regulator that offers flexible output power to the application. For post-regulation, the device includes two synchronous buck and one asynchronous boost converter, working at a switching frequency of 2.45 MHz to allow for a smaller inductor which requires less board space. The two buck converters also offer internal loop compensation which eliminates the need for external compensation components. Furthermore, the device includes a low-noise linear regulator.

Device Information(1)

DEVICE NAME PACKAGE BODY SIZE
TPS65311-Q1 VQFN (56) 8.00 mm × 8.00 mm
VQFNP (56) 8.00 mm × 8.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

TPS65311-Q1 alt_slvsca6.gif

4 Revision History

Changes from B Revision (April 2014) to C Revision

  • Added the VQFNP (RWE) package option to the data sheet Go
  • Added pin descriptions for the S1 and S2 pins in the Pin Functions tableGo
  • Deleted the lead temperature (soldering, 10 sec), 260°C parameter from the Absolute Maximum Ratings tableGo
  • Changed the Handling Ratings table to ESD Ratings and moved storage temperature back to the Absolute Maximum Ratings tableGo
  • Changed all the thermal values for the RWE package in the Thermal Information tableGo
  • Added the Receiving Notification of Documentation Updates and Community Resources sectionsGo

Changes from A Revision (October 2013) to B Revision

  • Changed CDM ESD Classification Level from C3B to C4B in the Features list and ESD ratings Go
  • Added device number to document titleGo
  • Added Device Information table to first page and Table of Contents to second page. Moved Revision History to second page alsoGo
  • Added two new paragraphs following the first paragraph in the Description section Go
  • Deleted simplified block diagram from first page and added new schematic image Go
  • Moved the pin diagram and function table to before the electrical specifications and change it to the Pin Configurations and Functions section Go
  • Added the word range to the Absolute Maximum RatingsGo
  • Moved the electrical specifications tables into the Specifications section Go
  • Moved the ESD ratings and storage temperature out of the Absolute Maximum Ratings table and into the Handling Ratings table. Also added the ESD HBM and CDM notesGo
  • Changed both max values for TJ from 125 to 150 in the RECOMMEND OPERATING CONDITIONS tableGo
  • Lowered all thermal values in the Thermal Information table Go
  • Changed condition statement of ELECTRICAL CHARACTERISTICS table from TJ(max) = 125°C to TJ(max) = 150°CGo
  • Added test condition for IOUT = 350 mA, TJ = 150°C to the VDropout parameter in the ELECTRICAL CHARACTERISTICS tableGo
  • Changed the min value for the VHSSC_HY parameter from 1.5 to 1 and deleted the typ (2.5) and max (3.5) valuesGo
  • Moved all timing specifications from the Electrical Characteristics table into the Timing Requirements table and added figure references to the timing diagramGo
  • Changed the max value for the tVSSENSE_BLK parameter from 20 to 35Go
  • Changed the MAX value for the WD filter time parameter from 0.5 µs to 1.2 µs in the Timing Requirements table Go
  • Changed the min value for the tGL-BLK parameter from 10 to 5Go
  • Moved all switching characteristics out of the Electrical Characteristics and into the new Switching Characteristics table Go
  • Moved all but the first paragraph of the Description into the new Overview section in the Detailed Description sectionGo
  • Moved the block diagram into the Detailed Description section Go
  • Deleted the Operating Modes table and Normal Mode PWM Operation section title for Buck Controller (BUCK1)Go
  • Changed the resistor name for the resistor next to C1 from R1 to R3 and added R1 and R2 to the Detailed Block Diagram of Buck 1 Controller imageGo
  • Moved the component selection portion of the Synchronous Buck Converters BUCK2 and BUCK3 section into the Typical Applications section Go
  • Moved the component selection portion of the BOOST Converter section into the Typical Applications section Go
  • Changed the voltage value that EXTSUP is connected to from 4.6 to 4.8 in the Gate Driver Supply section Go
  • Moved the SPI section into a Programming section Go
  • Added the Design Parameters tables for each of the Typical Application sectionsGo
  • Added the Adjusting the Output Voltage for the BUCK1 Controller section to the Buck Controller (BUCK1) application sectionGo
  • Moved the component selection portion of the Buck Controller (BUCK1) section into the Typical Applications section Go
  • Changed R1 to R3 in the Compensation of the Buck Controller sectionGo
  • Added the Adjusting the Output Voltage for the BUCK2 and BUCK3 Converter to the Detailed Design Procedure in the Synchronous Buck Converters BUCK2 and BUCK3 sectionGo
  • Changed the inductance, capacitance and FLC values from 3.3 µH, 20 µF, and 12.9 kHz to 1.5 µH, 39 µF, and 13.7 kHz (respectively) in the For example: section of the Compensation of the BOOST Converter sectionGo
  • Added the Linear Regulator application section Go
  • Added the Device and Documentation Support and Mechanical, Packaging, and Orderable Information sections. The Device and Documentation Support now includes the electrostatic discharge caution, trademark information, and a link to the TI GlossaryGo

Changes from * Revision (October 2013) to A Revision

  • Changed document status from Product Preview to Production DataGo
  • Deleted both min values (–44°C and –55°C) for TJ in the RECOMMENDED OPERATING CONDITIONS tableGo
  • Changed both max values for TJ from 150°C to 125°C in the RECOMMENDED OPERATING CONDITIONS tableGo
  • Changed condition statement of ELECTRICAL CHARACTERISTICS table from TJ temperature range to TJ(max) = 125°CGo
  • Changed one test condition for the VDroupout parameter in the ELECTRICAL CHARACTERISTICS table from TJ = 150°C to TJ = 125°CGo
  • Deleted the TJ temperature range from SHUTDOWN COMPARATOR subheader row in the ELECTRICAL CHARACTERISTICS tableGo
  • Changed one test condition for the IVT_leak parameter in the ELECTRICAL CHARACTERISTICS table from TJ = –20°C to 150°C to TJ = –20°C to 125°CGo
  • Changed the TJ temperature range to TJ(max) = 125°C for the INTERNAL VOLTAGE REGULATORS subheader row in the ELECTRICAL CHARACTERISTICS tableGo