SLVSCA6C October   2013  – October 2017 TPS65311-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
      1. 7.8.1 BUCK 1 Characteristics
      2. 7.8.2 BUCK 2 and BUCK3 Characteristics
      3. 7.8.3 BOOST Characteristics
      4. 7.8.4 LDO Noise Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Buck Controller (BUCK1)
      2. 8.3.2  Synchronous Buck Converters BUCK2 and BUCK3
      3. 8.3.3  BOOST Converter
      4. 8.3.4  Frequency-Hopping Spread Spectrum
      5. 8.3.5  Linear Regulator LDO
      6. 8.3.6  Gate Driver Supply
      7. 8.3.7  RESET
      8. 8.3.8  Soft Start
      9. 8.3.9  Power-on Reset Flag
      10. 8.3.10 WAKE Pin
      11. 8.3.11 IRQ Pin
      12. 8.3.12 VBAT Undervoltage Warning
      13. 8.3.13 VIN Over or Undervoltage Protection
      14. 8.3.14 External Protection
      15. 8.3.15 Overtemperature Detection and Shutdown
      16. 8.3.16 Independent Voltage Monitoring
      17. 8.3.17 GND Loss Detection
      18. 8.3.18 Reference Voltage
      19. 8.3.19 Shutdown Comparator
      20. 8.3.20 LED and High-Side Switch Control
      21. 8.3.21 Window Watchdog
      22. 8.3.22 Timeout in Start-Up Modes
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
        1. 8.4.1.1  INIT
        2. 8.4.1.2  TESTSTART
        3. 8.4.1.3  TESTSTOP
        4. 8.4.1.4  VTCHECK
        5. 8.4.1.5  RAMP
          1. 8.4.1.5.1 Power-Up Sequencing
          2. 8.4.1.5.2 Power-Down Sequencing
        6. 8.4.1.6  ACTIVE
        7. 8.4.1.7  ERROR
        8. 8.4.1.8  LOCKED
        9. 8.4.1.9  LPM0
        10. 8.4.1.10 SHUTDOWN
    5. 8.5 Programming
      1. 8.5.1 SPI
        1. 8.5.1.1 FSI Bit
    6. 8.6 Register Map
      1. 8.6.1 Register Description
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Buck Controller (BUCK1)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Adjusting the Output Voltage for the BUCK1 Controller
          2. 9.2.1.2.2 Output Inductor, Sense Resistor, and Capacitor Selection for the BUCK1 Controller
          3. 9.2.1.2.3 Compensation of the Buck Controller
          4. 9.2.1.2.4 Bootstrap Capacitor for the BUCK1 Controller
        3. 9.2.1.3 BUCK 1 Application Curve
      2. 9.2.2 Synchronous Buck Converters BUCK2 and BUCK3
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Adjusting the Output Voltage for the BUCK2 and BUCK3 Converter
          2. 9.2.2.2.2 Output Inductor Selection for the BUCK2 and BUCK3 Converter
          3. 9.2.2.2.3 Compensation of the BUCK2 and BUCK3 Converters
          4. 9.2.2.2.4 Bootstrap Capacitor for the BUCK2/3 Converters
        3. 9.2.2.3 BUCK2 and BUCK3 Application Curves
      3. 9.2.3 BOOST Converter
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Adjusting the Output Voltage for the Boost Converter
          2. 9.2.3.2.2 Output Inductor and Capacitor Selection for the BOOST Converter
          3. 9.2.3.2.3 Compensation of the BOOST Converter
          4. 9.2.3.2.4 Output Diode for the BOOST Converter
        3. 9.2.3.3 BOOST Converter Application Curves
      4. 9.2.4 Linear Regulator
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
          1. 9.2.4.2.1 Adjusting the Output Voltage for the Linear Regulator
          2. 9.2.4.2.2 Output Capacitance for the Linear Regulator
        3. 9.2.4.3 Linear Regulator Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Buck Controller
      2. 11.1.2 Buck Converter
      3. 11.1.3 Boost Converter
      4. 11.1.4 Linear Regulator
      5. 11.1.5 Other Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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12 Device and Documentation Support

12.1 Documentation Support

For related documentation see the following:

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.