• Menu
  • Product
  • Email
  • PDF
  • Order now
  • TMUX741xEVM and TMUX746EVM User's Guide

    • SCDU019 June   2021

       

  • CONTENTS
  • SEARCH
  • TMUX741xEVM and TMUX746EVM User's Guide
  1.   Abstract
  2.   Trademarks
  3. 11. Introduction
    1. 1.1 Information About Cautions and Warnings
  4. 23. Features of This EVM
  5. 34. TMUX741-746EVM Setup
  6. 45. TMUX741-746EVM Jumper Connections and Test Points
  7. 56. Schematics
  8. 67. Bill of Materials
  9. 78. PCB Layouts
  10. 8Related Documentation
  11. IMPORTANT NOTICE
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

EVM USER'S GUIDE

TMUX741xEVM and TMUX746EVM User's Guide

Abstract

This document is the EVM user’s guide for the TMUX741-746EVM which provides a board for quick DC parmeter testing for the TMUX741x and TMUX746x families in the QFN and TSSOP package families.

Trademarks

All trademarks are the property of their respective owners.

1 1. Introduction

This user’s guide describes the TMUX741-746 evaluation module (EVM) and its intended use. This board allows for the quick prototyping and DC characterization of TI’s TMUX741x/TMUX746x Line of parts in either QFN (RRP) or TSSOP (PW) packages. Figure 1-1 and Figure 1-2 show the top and bottom sides of the board respectively.

GUID-20210615-CA0I-HPQB-MT5F-Z4PKV6SVDBG8-low.jpg Figure 1-1 TMUX741-746EVM Top Side View
GUID-20210615-CA0I-DJTT-KPXS-NFGBH3V8DKDG-low.jpg Figure 1-2 TMUX741-746EVM Bottom Side View

1.1 Information About Cautions and Warnings

The information in the warning statement is provided for personal protection and the information in the caution statement is provided to protect the equipment from damage. Read each caution and warning statement carefully.

GUID-ED3721F4-D5D2-43AA-98F7-19FF9FDCAB2C-low.gif

This EVM contains components that can ptentially be damaged by electrostatic discharge. Always transport and store the EVM in its supplied ESD bad when not in suse. Handle using an antistatic wristband. Operate on an antistatic work surface. For more information on proper handling, see Electrostatic Discharge (ESD).

2 3. Features of This EVM

The EVM has the following features:

  • Four power supply decoupling capacitors from VDD to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)
  • One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)
  • One power supply decoupling capacitors from VSS to Ground (2 × 3.3 µF, 1 µF, 0.1 µF)
  • One additional power supply decoupling capacitor pad from VDD to Ground (0.1 µF)
  • Protection diode pads available near VDD and VSS input.
  • 10 µF supply decoupling capacitor to Ground on both VFP and VFN supplies
  • Protection diode pads available near VFP and VFN inputs
  • Up to four auxiliary pathways available with jumpers
  • Up to eight analog I/O pathways available
  • All analog I/O pathways have pads available to load device
  • All analog I/O pathways have pads available to support SMA connections to device.
  • Fault indicator flag LED circuit included on EVM

 

Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale