使用此完全可编程的无线微控制器 (MCU) 模块开始您的设计,它经过 FCC、IC、CE、MIC 和 SRRC 认证,且具有内置 Wi-Fi 连接。德州仪器 (TI)™ 的 SimpleLink™ CC3220MODx 和 CC3220MODAx 模块系列专为物联网而设计,是集成了两个物理隔离片上 MCU 的无线模块。
CC3220MODx 和 CC3220MODAx 无线 MCU 系列属于 TI 第二代 Internet-on-a chip™ 系列解决方案。这一代引进了可进一步简化互联网连接的新特性和功能。新功能包括:
电源管理子系统包括支持宽电源电压范围的集成式直流/直流转换器。此子系统支持低功耗深度睡眠、RTC 休眠(仅消耗 5µA)和关断模式(仅消耗
1µA)等低功耗模式,有助于延长电池寿命。
该模块包含多种外设,如快速并行摄像头接口、I2S、SD、UART、SPI、I2C 和 4 通道 ADC。
SimpleLink CC3220MODx 和 CC3220MODAx 模块系列有 4 个不同的模块型号:CC3220MODS、CC3220MODSF、CC3220MODA 和 CC3220MODASF。
这 4 个模块集成有 40MHz 晶体、32.768kHz RTC 时钟、32Mb SPI 串行闪存、射频滤波器和无源器件。这些模块还具有其他安全功能,例如经过加密和身份验证的文件系统、用户 IP 加密和身份验证、安全引导(闪存引导时对应用映像进行身份验证和完整性验证)等。
CC3220MODx 和 CC3220MODAx 器件是 SimpleLink™ MCU 平台的一部分,包含 Wi-Fi、低功耗蓝牙®、低于 1GHz 和主机 MCU。它们都共用配有单核软件开发套件 (SDK) 和丰富工具集的通用、易用型开发环境。一次性集成 SimpleLink 平台后,用户可以将产品组合中器件的任何组合添加至您的设计中。SimpleLink 平台的最终目标是确保设计要求变更时,完全重复使用代码。
CC3220MODx 和 CC3220MODAx 模块系列是完整的平台解决方案,其中包括软件、示例应用、工具、用户和编程指南、参考设计以及 E2E™ 在线社区。该模块系列还是 SimpleLink™ MCU 产品系列的一部分,并且支持 SimpleLink™ 开发人员生态系统。如需了解更多相关信息,请访问 www.ti.com.cn/simplelink/cn。
器件型号 | 封装 | 封装尺寸(标称值) |
---|---|---|
CC3220MODSM2MOBR | QFM (63) | 20.50mm × 17.50mm |
CC3220MODSF12MOBR | QFM (63) | 20.50mm × 17.50mm |
CC3220MODASM2MONR | QFM (63) | 25.50mm × 20.50mm |
CC3220MODASF12MONR | QFM (63) | 25.50mm × 20.50mm |
图 4-1 显示了 CC3220MODx 模块的功能方框图。
图 4-2 显示了 CC3220MODAx 模块的功能方框图。
图 4-4 显示了 CC3220x 硬件概述。
图 4-5 显示了 CC3220x 嵌入式软件的概述。
Changes from September 22, 2020 to May 13, 2021 (from Revision D (September 2020) to Revision E (May 2021))
Table 6-1 shows the features supported across different CC3x20 modules.
FEATURE | DEVICE | ||||
---|---|---|---|---|---|
CC3120MOD | CC3220MODS | CC3220MODSF | CC3220MODAS | CC3220MODASF | |
On-board chip | CC3120 | CC3220S | CC3220SF | CC3220S | CC3220SF |
On-board ANT | No | No | No | Yes | Yes |
sFlash | 32-Mbit | 32-Mbit | 32-Mbit | 32-Mbit | 32-Mbit |
Regulatory certifications | FCC, IC, CE, MIC, SRRC | FCC, IC, CE, MIC, SRRC | FCC, IC, CE, MIC, SRRC | FCC, IC, CE, MIC, SRRC | FCC, IC, CE, MIC, SRRC |
Wi-Fi Alliance® Certification | Yes | Yes | Yes | Yes | Yes |
Input voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
Package | 17.5 mm × 20.5 mm QFM | 17.5 mm × 20.5 mm QFM | 17.5 mm × 20.5 mm QFM | 25.0 mm × 20.5 mm QFM | 25.0 mm × 20.5 mm QFM |
Operating temperature range | –40°C to +85°C | –40°C to +85°C | –40°C to +85°C | –40°C to +85°C | –40°C to +85°C |
Classification | Wi-Fi Network Processor | Wireless Microcontroller | Wireless Microcontroller | Wireless Microcontroller | Wireless Microcontroller |
Standard | 802.11 b/g/n | 802.11 b/g/n | 802.11 b/g/n | 802.11 b/g/n | 802.11 b/g/n |
Frequency | 2.4 GHz | 2.4 GHz | 2.4 GHz | 2.4 GHz | 2.4 GHz |
TCP/IP Stack | IPv4, IPv6 | IPv4, IPv6 | IPv4, IPv6 | IPv4, IPv6 | IPv4, IPv6 |
Sockets | 16 | 16 | 16 | 16 | 16 |
Integrated MCU | – | Arm® Cortex®-M4 at 80 MHz | Arm® Cortex®-M4 at 80 MHz | Arm® Cortex®-M4 at 80 MHz | Arm® Cortex®-M4 at 80 MHz |
ON-CHIP APPLICATION MEMORY | |||||
RAM | – | 256KB | 256KB | 256KB | 256KB |
Flash | – | – | 1MB | – | 1MB |
PERIPHERALS AND INTERFACES | |||||
Universal Asynchronous Receiver/Transmitter (UART) |
1 | 2 | 2 | 2 | 2 |
Serial Port Interface (SPI) | 1 | 1 | 1 | 1 | 1 |
Multichannel Audio Serial Port (McASP)- I2S or PCM | – | 2-ch | 2-ch | 2-ch | 2-ch |
Inter-Integrated Circuit (I2C) | – | 1 | 1 | 1 | 1 |
Analog-to-digital converter (ADC) | – | 4-ch, 12-bit | 4-ch, 12-bit | 4-ch, 12-bit | 4-ch, 12-bit |
Parallel interface (8-bit PI) | – | 1 | 1 | 1 | 1 |
General-purpose timers | – | 4 | 4 | 4 | 4 |
Multimedia card (MMC / SD) | – | 1 | 1 | 1 | 1 |
SECURITY FEATURES | |||||
Wi-Fi level of security | WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x), WPA3 personal and enterprise | WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x), WPA3 personal and enterprise | WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x), WPA3 personal and enterprise | WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x), WPA3 personal and enterprise | WEP, WPS, WPA / WPA2 PSK WPA2 (802.1x), WPA3 personal and enterprise |
Secure sockets (SSL v3 or TLS 1.0 /1.1/ 1.2) | 6 | 6 | 6 | 6 | 6 |
Additional networking security | Unique Device Identity Trusted Root-Certificate Catalog TI Root-of-Trust Public key |
Unique Device Identity Trusted Root-Certificate Catalog TI Root-of-Trust Public key |
Unique Device Identity Trusted Root-Certificate Catalog TI Root-of-Trust Public key |
Unique Device Identity Trusted Root-Certificate Catalog TI Root-of-Trust Public key |
Unique Device Identity Trusted Root-Certificate Catalog TI Root-of-Trust Public key |
Hardware acceleration | Hardware Crypto Engines | Hardware Crypto Engines | Hardware Crypto Engines | Hardware Crypto Engines | Hardware Crypto Engines |
Secure boot | – | Yes | Yes | Yes | Yes |
Enhanced Application Level Security | – | File system security Secure key storage Software tamper detection Cloning protection Initial secure programming |
File system security Secure key storage Software tamper detection Cloning protection Initial secure programming |
File system security Secure key storage Software tamper detection Cloning protection Initial secure programming |
File system security Secure key storage Software tamper detection Cloning protection Initial secure programming |
For information about other devices in this family of products or related products see the links below.
Figure 7-1 shows the pin diagram for the CC3220MODx module.
Figure 7-2 shows the pin diagram for the CC3220MODAx module.
Section 7.2.1 lists the pin descriptions of the CC3220MODx and CC3220MODAx module.
MODULE PIN | TYPE(1) | CC3220 DEVICE PIN NO. | MODULE PIN DESCRIPTION | |
---|---|---|---|---|
NO. | NAME | |||
1 | GND | – | – | Ground |
2 | GND | – | – | Ground |
3 | GPIO10 | I/O | 1 | GPIO(2) |
4 | GPIO11 | I/O | 2 | GPIO(2) |
5 | GPIO14 | I/O | 5 | GPIO(2) |
6 | GPIO15 | I/O | 6 | GPIO(2) |
7 | GPIO16 | I/O | 7 | GPIO(2) |
8 | GPIO17 | I/O | 8 | GPIO(2) |
9 | GPIO12 | I/O | 3 | GPIO(2) |
10 | GPIO13 | I/O | 4 | GPIO(2) |
11 | GPIO22 | I/O | 15 | GPIO(2) |
12 | JTAG_TDI | I/O | 16 | JTAG TDI input. Leave unconnected if not used on product(2) |
13 | FLASH_SPI_MISO | I | – | External Serial Flash Programming: SPI data in |
14 | FLASH_SPI_nCS_IN | I | – | External Serial Flash Programming: SPI chip select (active low) |
15 | FLASH_SPI_CLK | I | – | External Serial Flash Programming: SPI clock |
16 | GND | – | – | Ground |
17 | FLASH_SPI_MOSI | O | – | External Serial Flash Programming: SPI data out |
18 | JTAG_TDO | I/O | 17 | JTAG TDO output. Leave unconnected if not used on product(1) |
19 | GPIO28 | I/O | 18 | GPIO(2) |
21 | JTAG_TCK | I/O | 19 | JTAG TCK input. Leave unconnected if not used on product.(2) |
22 | JTAG_TMS | I/O | 20 | JTAG TMS input. Leave unconnected if not used on product.(2) |
23 | SOP2 | – | 21 | See Section 9.9.1 for SOP[2:0] configuration modes. |
24 | SOP1 | – | 34 | See Section 9.9.1 for SOP[2:0] configuration modes. |
25 | ANT_SEL1 | I/O | 29 | Antenna selection control(2) |
26 | ANT_SEL2 | I/O | 30 | Antenna selection control(2) |
27 | GND | – | – | Ground |
28 | GND | – | – | Ground |
30 | GND | – | – | Ground |
31 | RF_BG | I/O | 31 | 2.4-GHz RF input/output |
32 | GND | – | – | Ground |
34 | SOP0 | – | 35 | See Section 9.9.1 for SOP[2:0] configuration modes. |
35 | nRESET | I | 32 | There is an internal,
100 kΩ, pull-up resistor option from the nRESET pin to VBAT_RESET.
Note: VBAT_RESET is not connected to VBAT1 or VBAT2 within the
module. The following connection schemes are recommended:
|
36 | VBAT_RESET | – | 37 | |
37 | VBAT1 | Power | 39 | Power supply for the module, must be connected to battery (2.3 V to 3.6 V) |
38 | GND | – | – | Ground |
40 | VBAT2 | Power | 10, 44, 54 | Power supply for the module, must be connected to battery (2.3 V to 3.6 V) |
42 | GPIO30 | I/O | 53 | GPIO(2) |
43 | GND | – | – | Ground |
44 | GPIO0 | I/O | 50 | GPIO(2) |
46 | GPIO1 | I/O | 55 | GPIO(2) |
47 | GPIO2 | I/O | 57 | GPIO(2) |
48 | GPIO3 | I/O | 58 | GPIO(2) |
49 | GPIO4 | I/O | 59 | GPIO(2) |
50 | GPIO5 | I/O | 60 | GPIO(2) |
51 | GPIO6 | I/O | 61 | GPIO(2) |
52 | GPIO7 | I/O | 62 | GPIO(2) |
53 | GPIO8 | I/O | 63 | GPIO(2) |
54 | GPIO9 | I/O | 64 | GPIO(2) |
55 | GND | – | – | Thermal ground |
56 | GND | – | – | Thermal ground |
57 | GND | – | – | Thermal ground |
58 | GND | – | – | Thermal ground |
59 | GND | – | – | Thermal ground |
60 | GND | – | – | Thermal ground |
61 | GND | – | – | Thermal ground |
62 | GND | – | – | Thermal ground |
63 | GND | – | – | Thermal ground |