ZHCSFK1D July   2016  – January 2025 TLV700XX-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Internal Current Limit
      2. 6.3.2 Shutdown
      3. 6.3.3 Dropout Voltage
      4. 6.3.4 Undervoltage Lockout (UVLO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation with VIN Less Than 2V
      2. 6.4.2 Operation with VIN Greater Than 2V
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Requirements
      2. 7.1.2 Transient Response
      3. 7.1.3 Thermal Protection
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitance
        2. 7.2.2.2 Output Capacitance
        3. 7.2.2.3 Thermal Calculation
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Board Layout Recommendations to Improve PSRR and Noise Performance
      3. 7.4.3 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.5 Electrical Characteristics

at TA = –40°C to +125°C, VIN = VOUT(TYP) + 0.3V or 2V (whichever is greater), IOUT = 10mA, VEN = VIN, and COUT = 1µF (unless otherwise noted); typical values are at TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT DC output accuracy –40°C ≤ TA ≤ +125°C, VOUT ≥ 1V –2% 2%
ΔVO/ΔVIN Line regulation VOUT(NOM) + 0.5V ≤ VIN ≤ 5.5V,
IOUT = 10mA		 1 5 mV
ΔVO/ΔIOUT Load regulation 0mA ≤ IOUT ≤ 200mA 15 mV
VDO Dropout voltage(1) VIN = 0.98 × VOUT(NOM), IOUT = 200mA 175 250 mV
ICL Output current limit VOUT = 0.9 × VOUT(NOM) 220 350 860 mA
IGND Ground pin current IOUT = 0mA 31 55 µA
IOUT = 200mA, VIN = VOUT + 0.5V 270
ISHDN Ground pin current (shutdown) VEN ≤ 0.4V, 2.0V ≤ VIN ≤ 4.5V 1 2.5 µA
PSRR Power-supply rejection ratio VIN = 2.3V, VOUT = 1.8V, IOUT = 10mA,
f = 1kHz		 68 dB
VN Output noise voltage BW = 100Hz to 100kHz, VIN = 2.3V,
VOUT = 1.8V, IOUT = 10mA		 48 µVRMS
tSTR Startup time(2) COUT = 1µF, IOUT = 200mA 100 µs
VEN(HI) Enable pin high (enabled) 0.9 VIN V
VEN(LO) Enable pin low (disabled) 0 0.4 V
IEN Enable pin current VEN = 5.5V , IOUT = 10µA 0.04 0.5 µA
UVLO Undervoltage lockout VIN rising 1.9 V
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140
TA Operating ambient temperature –40 125 °C
(1) VDO is measured for devices with VOUT(NOM) ≥ 2.35V.
(2) Startup time = time from EN assertion to 0.98 × VOUT(NOM).