TIDUEA0A March   2019  – September 2020

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 Device Recommendation
      2. 2.3.2 Digital Temperature Sensor - TMP117
      3. 2.3.3 Digital Temperature Sensor - TMP116
      4. 2.3.4 ESD Protection Devices
    4. 2.4 System Design Theory
      1. 2.4.1 PT100, PT500, PT1000 based Measurement in Heat Meters
      2. 2.4.2 TMP117 Configuration as Temperature Sensor
      3. 2.4.3 Digital RTD Solution Using TMP117
      4. 2.4.4 Ambient Temperature Considerations
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
      1. 3.1.1 Hardware
      2. 3.1.2 Interface Test Software for TMP116
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup for Performance Testing
      2. 3.2.2 EMI and EMC Test Requirements for DRTD
      3. 3.2.3 TMP117 EMI/EMC Test Results
      4. 3.2.4 TMP117 Based Temperature Probe Measurement Performance Test Results
      5. 3.2.5 TMP116 Based Temperature Probe Measurement Performance Test Results
      6. 3.2.6 I2C-bus Cable Length Considerations
      7. 3.2.7 Power Supply
      8. 3.2.8 ESD Test Results for TMP116
      9. 3.2.9 Summary
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  10. 5Software Files
  11. 6Related Documentation
    1. 6.1 Trademarks
  12. 7About the Author
  13. 8Revision History

7 About the Author

MILEN STEFANOV (M.Sc.E.E) is a system engineer at TI, working in the Grid Infrastructure field and an expert in RF communication technologies and metering applications. After graduating there, he spent 5 more years as a research assistant at the University of Chemnitz (TUC) and the following 3.5 years as a system engineer in the semiconductor industry with focus on high-speed optical and wired communications. He joined TI in 2003 to become a Wi-Fi® expert and support TI’s Wi-Fi products at major OEMs. Since 2010, he has focused on metering and Sub-1 GHz RF solutions for the European Grid Infrastructure market. Mr. Stefanov has published multiple articles on wM-Bus technology in several European magazines and presented technical papers at the Wireless Congress and Smart Home & Metering summits in Munich.

CAL MUCKELBAUER is an systems engineer at TI, where he is responsible for developing reference design solutions for the Grid Infrastructure segment. He joined TI in 2019 immediately after graduating with a bachlors of Science in electrical engineering from University of Maryland, College Park.

KALLIKUPPA MUNIYAPPA SREENIVASA is a systems architect at Texas Instruments, where he is responsible for developing reference design solutions for the industrial segment. Sreenivasa brings to this role his experience in high-speed digital and analog systems design. Sreenivasa earned his bachelor of engineering (BE) in electronics and communication engineering (BE-E&C) from VTU, Mysore, India.