SPRAD64 November   2022 AM620-Q1 , AM623 , AM625 , AM625-Q1

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Width/Spacing Proposal for Escapes
  4. 3 Stackup
  5. 4 Via Sharing
  6. 5 Floorplan Component Placement
  7. 6 Critical Interfaces Impact Placement
  8. 7 Routing Priority
  9. 8 SerDes Interfaces
  10. 9 DDR Interfaces
  11. 10Power Decoupling
  12. 11Route Lowest Priority Interfaces Last
  13. 12Summary

4 Via Sharing

The FC-BGA pattern implemented on the AM62x (AMC) design offers several opportunities for via sharing. Vias are shared across BGA pins. Figure 4-1 and Figure 4-2 show the via sharing opportunities for VDD_CORE and VSS power supplies respectively. Further opportunities for other power domains are illustrated in Figure 4-3. Via sharing across BGA pins provides for easier escape routing and also robust electrical connection by connecting multiple pins.

GUID-57AD266B-FF29-40E9-AB73-2CB58580491D-low.png Figure 4-1 Via Sharing for VDD_CORE Domain
GUID-F0F11CB4-99B0-468C-AD1F-27F025196498-low.png Figure 4-2 Via Sharing for VSS
GUID-C1E63433-46CA-4853-A832-35AA95F367B3-low.png Figure 4-3 Via Sharing for Other Power Domains