SNVU834 September   2022 TPSM365R6

 

  1.   Abstract
  2.   Trademarks
  3. 1Setup
    1. 1.1 Test Points
    2. 1.2 Jumpers
  4. 2Operation
    1. 2.1 Quick Start
  5. 3Schematic
  6. 4Board Layout
  7. 5Bill of Materials
  8. 6Typical Characteristics
  9. 7Application Curves

Board Layout

GUID-20220912-SS0I-HFD4-2NNP-MKBKWW0FBLGQ-low.gif Figure 4-1 Top View of EVM
GUID-20220912-SS0I-LCPG-T9BG-DGZFHWC4N7Z6-low.gif Figure 4-2 EVM Top Copper Layer
GUID-20220912-SS0I-NCPL-M8CP-MZFCWK4XZWWW-low.gif Figure 4-3 EVM Mid Layer One
GUID-20220912-SS0I-C5VD-2SQX-HBXTBJZMBKKB-low.gif Figure 4-4 EVM Mid Layer Two
GUID-20220912-SS0I-S3GL-FP3T-QZ5ZKVRMFB9T-low.gif Figure 4-5 EVM Bottom Copper Layer