SNVU819 November   2021 LM5168 , LM5168-Q1

 

  1.   Trademarks
  2. 1General TI High Voltage Evaluation User Safety Guidelines
  3. 2EVM Characteristics
  4. 3LM5168FEVM Evaluation Module
    1. 3.1 Quick Start Procedure
    2. 3.2 Detailed Descriptions
  5. 4Schematic
  6. 5PCB Layout
  7. 6Bill of Materials
  8. 7Performance Curves

5 PCB Layout

Figure 5-1 through Figure 5-4 show the board layout for the LM5168FEVM.

The 8-pin SO PowerPAD™ package offers an exposed thermal pad, which must be soldered to the copper landing on the PCB for optimal thermal performance. The PCB consists of a 4-layer design. There are 2-oz copper planes on the top and bottom and 1-oz copper mid-layer planes to dissipate heat with an array of thermal vias under the thermal pad to connect to all four layers.

Figure 5-1 Top Layer
Figure 5-2 Mid-Layer 1 Ground Plane
Figure 5-3 Mid-Layer 2 Routing
Figure 5-4 Bottom Layer