3 Board Layout

Figure 3-1 to Figure 3-4 show the board layout for the LV14360PEVM. The PCB consists of a 4-layer design. 2-oz copper planes are applied on all four layers to dissipate heat with an array of thermal vias under the thermal pad to connect to all four layers.

Figure 3-1 Top Layer

Figure 3-2 Middle Layer 1

Figure 3-3 Middle Layer 2

Figure 3-4 Bottom Layer