SLVK244 January 2026 TRF0213-SEP
SEE testing was performed on a TRF0213-SEP device mounted on a TRF0213SEP-EVM. The device was provided power through J101 input (+SUPPLY = +5.25V and GND) using the PXIe-4139 precision power supply in a 4-wire configuration. The TRF0213-SEP was evaluated with AC input signal provided on the INP input (J11). For the AC test, the input was driven onto the INP pin (J11) with R&S SGS100A signal generator (capable of providing a 6GHz signal) using a high speed coaxial cable. Input frequency was set to 500MHz, the input amplitude was set in a way that the output as measured on the oscilloscope was 500mVPP. The PD pin (J14 jumper) was connected to GND during the testing.
The device was evaluated in differential mode. SEEs where monitored using a Mixed Signal Oscilloscope, MSO58B (8-channel, 1GHz, 25GS/s, 62.5M record length). The differential output of the TRF0213-SEP is converted to single ended using a Hyperlabs HL9404 balun and was monitored. An attenuator pad of approximately 3dB was used at each output of the TRF0213SEP-EVM (J10, J12) and to the balun inputs.
The power supply (PS) was controlled and monitored using a custom-developed LabView™ program (PXI-RadTest) running on a NI-PXIe-8135 controller. The R&S SGS100A was controlled via the GPIB bus, using the stand alone LabView™ drivers. The MSO58B was controlled using the front-panel interface. The MSO was left in the cave at all times, to minimize the probe cable length. A keyboard, video, and mouse (KVM) extender was used to control and view the MSO from the control room at TAMU. A block diagram of the setup used for SEE testing the TRF0213-SEP is illustrated in Figure 6-1. Equipment settings and compliances used during the characterization are shown in Table 6-1. For the SEL testing the device was heated using a convection heat gun aimed at the die. A thermal imaging camera was employed to verify that the die temperature had stabilized at 125°C before proceeding with measurements
| Pin Name | Equipment Used | Capability | Compliance | Range of Values Used |
|---|---|---|---|---|
| VDD (J101) | NI PXIe-4139 | 3A | 3A | 5V, 5.25V, 5.5V |
| INP (J11) | R&S SGS100A | 5KHz-6GHz | — | 500MHz |
| OUTP (J10) and OUTM (J12) | Tektronix MSO58B | 12bit, 25GS/S | — | 25 GS/s |
All boards used for SEE testing were fully checked for functionality and dry runs performed to verify that the test system was stable under all bias and load conditions prior to being taken to the TAMU facility. During the heavy-ion testing, the LabView™ control program powered up the TRF0213-SEP device and set the external sourcing and monitoring functions of the external equipment. After functionality and stability had been confirmed, the beam shutter was opened to expose the device to the heavy-ion beam. The shutter remained open until the target fluence was achieved (determined by external detectors and counters).