SLVK226 October 2025 TPS7H4012-SEP
- 1
- TPS7H4012-SEP and TPS7H4013-SEP Single-Event Effects (SEE)
- Trademarks
- 1 Introduction
- 2 Single-Event Effects (SEE)
- 3 Device and Test Board Information
- 4 Irradiation Facility and Setup
- 5 LETEFF and Range Calculation
- 6 Test Setup and Procedures
- 7 Destructive Single-Event Effects (DSEE)
- 8 Single-Event Transients (SET)
- 9 Event Rate Calculations
- 10Summary
- A References
3 Device and Test Board Information
The TPS7H401x-SEP is packaged in a 44-pin plastic package as shown in Figure 3-1. The TPS7H401x-SEP evaluation module (EVM) was used to evaluate the performance and characteristics of the TPS7H401x-SEP under heavy ion radiation. The TPS7H4012EVM is shown in Figure 3-2 and its EVM schematic is shown in Figure 3-4. The TPS7H4013EVM is shown in Figure 3-3 and its EVM schematic is shown in Figure 3-4.
Figure 3-1 Photograph of Delidded TPS7H401x-SEP (Left) and Pinout Diagram (Right)The package was delidded to reveal the die face for all heavy-ion testing.
Figure 3-2 TPS7H4012-SEP EVM Top View. Jumper on J6 was configured in the 2-3 position for all testing
Figure 3-3 TPS7H4013-SEP EVM Top View. Jumper on J6 was configured in the 2-3 position for all testing
Figure 3-4 TPS7H4012EVM Schematics
Figure 3-5 TPS7H4013EVM Schematics