SLVAF55 July   2021 TPS62130 , TPS62901 , TPS62902 , TPS62903

 

  1.   Trademarks
  2. 1Introduction
  3. 2Power Density
  4. 3Achieving a Smaller Solution
    1. 3.1 Smaller Package and Fewer External Components
    2. 3.2 Smart Configuration Pin
    3. 3.3 VSET
  5. 4Reducing Power Loss
    1. 4.1 Junction Temperature
    2. 4.2 Automatic Efficiency Enhancement (AEE™)
    3. 4.3 1MHz and 2.5MHz Switching Frequencies
    4. 4.4 Auto PFM/PWM vs. Forced PWM
  6. 5Application Flexibility
    1. 5.1 Quiescent Current
    2. 5.2 Lower and More Accurate Output Voltages
    3. 5.3 Capacitive Discharge
  7. 6Summary
  8. 7References

Power Density

Power density is a term created to describe the power output of a device compared to its size. This is especially important in space constrained applications, or high functionality applications. These applications are mainly concerned with the space on the XY board area when talking about power density, but the Z (height) dimension can also be taken into consideration for total volume if desired. By shrinking the solution area, increasing the power output under similar conditions, or a combination of the two, the power density is positively impacted. As an example, comparing the 3-A rated parts in a case with 12 V on the input, 1.2 V on the output and in an ambient temperature of 65C, the TPS6290x is able to give the full 3-A load for a power density of 120mA/mm2. The TPS621x0 provides 2.7 A for a power density of 68mA/mm2 due to more power losses in the device. Section 3 provides additional detail of how the total solution size went from 40mm2 for TPS62130 to a solution size of 25mm2 in TPS62903. Section 4 describes how efficiency and thermals impact how much power is able to get out of a part.

Equation 1. PD=Current (mA)Area (mm2)