SLLU149E June 2011 – February 2016 TUSB7320 , TUSB7340
The solder mask is defined as a 1:1 ratio.
Figure 6-3 Solder Mask For the thermal pad, a 0.10-mm stencil thickness is recommended. The actual package exposed pad is 5.5 mm x 5.5 mm.
Figure 6-4 Thermal Pad Stencil Thickness