SLLT236A April   2025  – May 2026 UCC27614 , UCC27614-Q1 , UCC27624 , UCC27624-Q1 , UCC27624V , UCC27624V-Q1

 

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  3.   Trademarks

The UCC276x4 devices are a family of high-current, low-side drivers designed primarily to drive MOSFETs and IGBTs in both automotive and industrial applications. The family includes both the single channel UCC27614 and dual channel UCC27624 and UCC27624V. Some of the benefits are discussed below:

Power Density: The UCC276x4 family features high drive current, up to 10A, to reduce switching losses and improve overall system efficiency. This combined with the small SON package options for both the dual and single channel versions makes the UCC276x4 family one of the most power dense gate drivers available.

Robustness: The UCC276x4 family has a 30V max VDD and the –10V negative voltage handling enables excellent noise and transient handling without the need for external components such as clamp diodes on the inputs and outputs.

Flexibility: The UCC276x4 family of devices come in a multitude of common industry packages to fit design engineers' preferences and requirements. Package differences include thermal package options or even leadless options.

Table 1 Product Summary
Product FeaturesProduct BenefitsKey Applications
Up to 10A Drive StrengthEnables higher efficiency systems
  • Server Power
  • HEV/EV OBC + DC/DC
  • EV Charging
  • Micro-Inverter
  • Factory Automation
  • E-compressor
  • Data Center
30V Max VDDAn excellent choice for handling transients and noise in operation
–10V Negative Voltage Handling
4V or 8V UVLO OptionsFit for MosFET, GaN FET, or IGBT applications
2mm × 2mm Package (UCC27614) OptionHigh power density
10ns Minimum Input Pulse1MHz+ operation

Target End Equipments

The UCC276x4 family of devices can be used in many end equipments. Consider how the product features can improve a system design.

Table 2 The UCC276x4 Helps Improve Your System

Product Characteristic

System Improvement

Size 2mm × 2mm packages enable small board size.
Robustness 30V VDD and –10V negative voltage handling allows the UCC276x4 to better withstand noise and transients
Cost The excellent transient performance reduces the need for external components such as clamp diodes.
Using the UCC27624 with a pulse transformer eliminates the need for a bias supply.
Efficiency 4V UVLO allows for use with 5V power rail reducing overall power loss.
The 5A/10A output current helps reduce switching losses.
High drive current and low rise and fall times enable switching above 1MHz.
Flexibility UVLO, channel count, and package options help keep your system optimized.

Figure 1 through Figure 3 help explore some of the most popular use cases and respective topologies.

 UCC27624-Q1 in HEV-EV
                    DC-DC Figure 1 UCC27624-Q1 in HEV-EV DC-DC
 UCC27614 in Server Power Using
                    Interleaved Boost PFC Figure 2 UCC27614 in Server Power Using Interleaved Boost PFC
 UCC27624 in EV Charging Using
                    Phase-Shifted Full Bridge Driven by Pulse Transformers Figure 3 UCC27624 in EV Charging Using Phase-Shifted Full Bridge Driven by Pulse Transformers

Device Selection Guide

The UCC276x4 devices have distinct features, electrical specifications, and pinouts. To aid in selection, Table 3 through Table 6 help distinguish major differences between part numbers and variants, as well as provide insight to how these compare to legacy offerings.

Table 3 Device Selection Guide
Part NumberChannel CountGate Drive Output(Sink-Source)UVLOPackage Options
UCC27614 (-Q1)110A–10A4VD, DGN, DSG
UCC27624 (-Q1)25A–5A4VD, DGN, DSD, DGK, DDA
UCC27624V (-Q1)25A–5A8VD, DGN, DGK, DDA
Table 4 Pinout Maps for UCC27614
D 4.9mm × 3.9mm SOIC-8DSG 2mm × 2mm WSON-8DGN 3mm × 3mm HVSSOP-8
Table 5 Pinout Maps for UCC27624 and UCC27624V
D 4.9mm × 3.9mm
SOIC-8
DGN 3mm × 3mm HVSSOP-8DSD 3mm × 3mm WSON-8 DDA 4.9mm × 3.9mm HSOIC-8 DGK 3mm × 3mm VSSOP-8
Table 6 Legacy Devices Similar to UCC276x4
Legacy DeviceNew Replacement GPNPin-to-PinKey Advantages
UCC27524(A)UCC27624YesThe improved VDD and negative voltage provides for improved transient and noise handling
UCC27424UCC27624YesThe increased drive strength provides higher efficiency
UCC27322UCC27614YesThe improved VDD and negative voltage provides for improved transient and noise handling
UCC27511(A)UCC27614NoSmaller package options allow for reduced design size

References

Additional Information

Table 7 Orderable Table
Orderable DevicePackage TypePinsOp Temp (°C)Device Marking
UCC27624DGNR HVSSOP 8 –40 to 150 U624
UCC27624DR SOIC 8 –40 to 150 U27624
UCC27624DSDR SON 8 –40 to 150 624DSD
UCC27624DGKR VSSOP 8 –40 to 150 24DK
UCC27624DDAR SO PowerPAD™ 8 –40 to 150 U624DDA
UCC27624QDGNRQ1 HVSSOP 8 –40 to 150 624Q
UCC27624QDRQ1 SOIC 8 –40 to 150 27624Q
UCC27624QDSDRQ1 SON 8 –40 to 150 624QSD
UCC27624QDGKRQ1 VSSOP 8 –40 to 150 24QK
UCC27624QDDARQ1 SO PowerPAD 8 –40 to 150 U624QDDA
UCC27624VDGNR HVSSOP 8 –40 to 150 624V
UCC27624VDR SOIC 8 –40 to 150 27624V
UCC27624VDGKR VSSOP 8 –40 to 150 JVDK
UCC27624VDDAR SO PowerPAD 8 –40 to 150 U624VDDA
UCC27624VQDGNRQ1 HVSSOP 8 –40 to 150 24VQ
UCC27624VQDRQ1 SOIC 8 –40 to 150 U624VQ
UCC27624VQDGKRQ1 VSSOP 8 –40 to 150 JVQK
UCC27624VQDDARQ1 SO PowerPAD 8 –40 to 150 624VQDDA
UCC27614DR SOIC 8 –40 to 150 U27614
UCC27614DSGR WSON 8 –40 to 150 U614
UCC27614QDGNRQ1 HVSSOP 8 –40 to 150 614Q
UCC27614QDRQ1 SOIC 8 –40 to 150 27614Q
UCC27614QDSGRQ1 WSON 8 –40 to 150 614Q