SLAU739 October   2017

 

  1.   MSP430FR2433 LaunchPad™ Development Kit (MSP‑EXP430FR2433)
    1.     Trademarks
    2. 1 Getting Started
      1. 1.1 Introduction
      2. 1.2 Key Features
      3. 1.3 What's Included
        1. 1.3.1 Kit Contents
        2. 1.3.2 Software Examples
      4. 1.4 First Steps: Out-of-Box Experience
        1. 1.4.1 Connecting to the Computer
        2. 1.4.2 Running the Out-of-Box Demo
      5. 1.5 Next Steps: Looking Into the Provided Code
    3. 2 Hardware
      1. 2.1 Block Diagram
      2. 2.2 Hardware Features
        1. 2.2.1 MSP430FR2433 MCU
        2. 2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace Technology
        3. 2.2.3 Debug Probe Connection: Isolation Jumper Block
        4. 2.2.4 Application (or Backchannel) UART
        5. 2.2.5 Optional Features
          1. 2.2.5.1 Supercapacitor
      3. 2.3 Power
        1. 2.3.1 eZ-FET USB Power
        2. 2.3.2 BoosterPack and External Power Supply
        3. 2.3.3 Supercap (C6)
          1. 2.3.3.1 Charging the Supercap
          2. 2.3.3.2 Using the Supercap
          3. 2.3.3.3 Disabling the Supercap
      4. 2.4 Measure Current Draw of the MSP430 MCU
      5. 2.5 Clocking
      6. 2.6 Using the eZ-FET Debug Probe With a Different Target
      7. 2.7 BoosterPack Pinout
      8. 2.8 Design Files
        1. 2.8.1 Hardware
        2. 2.8.2 Software
      9. 2.9 Hardware Change log
    4. 3 Software Examples
      1. 3.1 Out-of-Box Software Example
        1. 3.1.1 Source File Structure
        2. 3.1.2 Overview
        3. 3.1.3 FRAM Data Logging Mode
        4. 3.1.4 Live Temperature Mode
      2. 3.2 Blink LED Example
        1. 3.2.1 Source File Structure
    5. 4 Resources
      1. 4.1 Integrated Development Environments
        1. 4.1.1 TI Cloud Development Tools
          1. 4.1.1.1 TI Resource Explorer Cloud
          2. 4.1.1.2 Code Composer Studio Cloud
        2. 4.1.2 Code Composer Studio IDE
        3. 4.1.3 IAR Embedded Workbench for Texas Instruments 430
      2. 4.2 LaunchPad Websites
      3. 4.3 MSPWare and TI Resource Explorer
      4. 4.4 FRAM Utilities
        1. 4.4.1 Compute Through Power Loss (CTPL)
        2. 4.4.2 Nonvolatile Storage (NVS)
      5. 4.5 MSP430FR2433 MCU
        1. 4.5.1 Device Documentation
        2. 4.5.2 MSP430FR2433 Code Examples
        3. 4.5.3 MSP430 Application Notes and TI Designs
      6. 4.6 Community Resources
        1. 4.6.1 TI E2E Community
        2. 4.6.2 Community at Large
    6. 5 FAQ
    7. 6 Schematics

2.5 Clocking

The MSP-EXP430FR2433 provides external clocks in addition to the internal clocks in the device.

  • Q1: 32-kHz Epson crystal (FC-135R) 12.5-pF crystal, part number: X1A0001410014

The 32-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clock sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used.

By default, the crystal is not connected to the MSP430FR2433 because the target pins are multiplexed with 2 BoosterPack header pins. 0-Ω resistors R4 and R5 need to be removed, while R2 and R3 must be shorted across, to connect the external crystal to the MSP430FR2433. See the onboard crystal selection resistors silkscreen for how to configure the resistors to select between the crystal or the BoosterPack pins.

The internal clocks in the device default to the following configuration:

  • MCLK: DCO 1 MHz
  • SMCLK: DCO 1 MHz
  • ACLK: REFO 32.768 kHz

For more information about configuring internal clocks and using the external oscillators, see the MSP430FR4xx and MSP430FR2xx Family User's Guide.