SLAA381C December   2007  – September 2018 MSP430F233 , MSP430F235 , MSP430F2410 , MSP430F247 , MSP430F248 , MSP430F249

 

  1.   Migrating From MSP430F13x and MSP430F14x MCUs to MSP430F23x and MSP430F24x MCUs
    1.     Trademarks
    2. 1 Comparison of MSP430F1xx and MSP430F2xx Families
    3. 2 Hardware Considerations for F13x/F14x to F23x/F24x Migration
      1. 2.1 Device Package and Pinout
      2. 2.2 Current Consumption
      3. 2.3 Operating Frequency and Supply Voltage
      4. 2.4 Device Errata
    4. 3 Firmware Considerations for F13x/F14x to F23x/F24x Migration
      1. 3.1 Memory Considerations
        1. 3.1.1 Device Memory Map
        2. 3.1.2 Information Flash Memory
      2. 3.2 Serial Communication – USART and USCI
        1. 3.2.1 UART Mode
        2. 3.2.2 SPI Mode
      3. 3.3 Clock System
        1. 3.3.1 LFXT1 and XT2 Oscillators
        2. 3.3.2 Digitally Controlled Oscillator (DCO)
      4. 3.4 Bootloader (BSL)
      5. 3.5 Interrupt Vectors
      6. 3.6 Beware of Reserved Bits!
      7. 3.7 Timers
      8. 3.8 Analog Comparator
    5. 4 References
  2.   Revision History

2.1 Device Package and Pinout

The good news is that a 64-pin LQFP F23x/F24x MCU directly drops into an existing F13x/F14x-based 64-pin LQFP or TQFP PCB footprint. The LQFP used by the two families is identical, and the PCB footprint is the same for both LQFP and TQFP. Both F13x/F14x and F23x/F24x are available in QFN packages. However, these packages differ slightly between the two device families. The exposed thermal pad on the F23x/F24x QFN package is slightly smaller than the one on the F13x/F14x package, and also the recommended SMT pad size differs slightly. Therefore, it is required to closely review the data sheet packaging specifications and the actual application PCB footprint during migration.

All F23x/F24x pins can be used for the same purpose as the pins on their F13x/F14x counterparts (which includes all analog and digital modules, as well as power supply and JTAG pins), enabling a transition to F23x/F24x MCUs without changes to the application PCB.

Details regarding packaging and pinouts can be found in the device-specific data sheets. [3][4]