SFFS990 May   2026 UCC27614-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DSG (SON 8) Package
    2. 2.2 D (SOIC 8) Package
    3. 2.3 DGN (VSSOP 8) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DSG (SON 8) Package
    2. 4.2 D (SOIC 8) and DGN (VSSOP 8) Package
  7. 5Revision History

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for the UCC27614-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure ModesFailure Mode Distribution (%)
DSG (SON 8)D (SOIC 8)DGN (VSSOP 8)
OUT stuck high281414
OUT stuck low281414
OUT functioning out of specification281414
EN stuck highN/A1414
EN stuck lowN/A1414
EN functioning out of specificationN/A1414
UVLO false reporting121212
Test mode | EMI performance444