SBAK044A February   2026  – March 2026 DAC39RF10-SP , DAC39RFS10-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Product Qualification and Reliability Report
  5. 2Space Grade MLS Production Flow
  6. 3Device Qualification
  7. 4Outgas Test Report
  8. 5Construction Exceptions and Manufacturing Flow Optimizations
  9. 6Revision History

5 Construction Exceptions and Manufacturing Flow Optimizations

Table 5-1 Construction Exceptions and Manufacturing Flow Optimizations
MIL-PRF-38535 Item Construction and Exception
Eutectic SnPb solder bumps Pb-free internal solder bumps encapsulated with underfill
Chip caps termination 32 Chip caps with pure-Sn termination not encapsulated
WLR Thermal stability not performed by TSMC FAB
TID Per TM 1019 Condition A

TI performed a single-lot Sn-whisker study on the DAC39RF10-SP 256ACL package with the following conditions:

REL TEST CONDITION SAMPLE SIZE RESULT
Temperature Cycling -55/85 C, 1500 cycles 1 lot, 3u/lot, 32 cap/unit, total 192 terminations 100% passed electrical testing. No whisker detected based on 100X optical inspection.
Unbiased Temperature Humidity Low 30C / 60%, 4000 Hours 1 lot, 3u/lot, 32 cap/unit, total 192 terminations 100% passed electrical testing. No whisker detected based on 100X optical inspection.
Unbiased Temperature Humidity High 55C / 85%, 4000 Hours 1 lot, 3u/lot, 32 cap/unit, total 192 terminations 100% passed electrical testing. No whisker detected based on 100X optical inspection.