ZHCS887D
May 2012 – April 2019
CDCUN1208LP
PRODUCTION DATA.
1
特性
2
应用
3
说明
引脚配置概述
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Digital Input Electrical Characteristics – OE (SCL), INSEL, ITTP, OTTP, Divide (SDA/MOSI), ERC(ADDR/CS), Mode
6.6
Universal Input (IN1, IN2) Characteristics
6.7
Clock Output Buffer Characteristics (Output Mode = LVDS)
6.8
Clock Output Buffer Characteristics (Output Mode = HCSL)
6.9
Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS)
6.10
Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
6.11
Clock Output Buffer Electrical Characteristics (Output Mode = LVCMOS) (Continued)
6.12
Typical Characteristics
7
Parameter Measurement Information
7.1
Test Configurations
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Device Control Using Configuration Pins
8.3.1.1
Configuration of Output Type (OTTP)
8.3.1.2
Configuration of Edge Rate Control (ERC)
8.3.1.3
Control of Output Enable (OE)
8.3.2
Input Ports (IN1, IN2)
8.3.2.1
Configuration of the Input Type (ITTP)
8.3.2.2
Configuration of the IN2 Divider (INDIV)
8.3.3
Smart Input Multiplexer (INMUX)
8.3.3.1
Pin Configuration of the Smart Input Multiplexer (INMUX)
8.4
Device Functional Modes
8.4.1
Device Control Using the Host Interface
8.4.1.1
OE and INSEL in Host Configuration Mode
8.5
Programming
8.5.1
Host Interface Hardware Information
8.5.1.1
SPI Communication
8.5.1.1.1
CDCUN1208LP SPI Addressing
8.5.1.1.2
Writing to the CDCUN1208LP
8.5.1.1.3
Reading From the CDCUN1208LP
8.5.1.1.4
Block Write/Read Operation
8.5.1.2
I2C Communication
8.5.1.2.1
Message Transmission
8.5.1.2.1.1
Data and Address Bits
8.5.1.2.1.2
Special Symbols – Start (S) and Stop (P)
8.5.1.2.1.3
Special Symbols – Acknowledge (ACK)
8.5.1.2.1.4
Generic Message Frame
8.5.1.2.1.5
CDCUN1208LP Message Format
8.5.1.2.1.6
CDCUN1208LP Device Addressing (I2C Address)
8.5.1.2.1.7
CDCUN1208LP Device Addressing (Register Address)
8.5.1.2.2
I2C Master and Slave Handshaking
8.5.1.2.3
Block Read/Write
8.5.1.2.4
I2C Timing
8.6
Register Maps
8.6.1
Device Registers
8.6.1.1
Device Registers: Register 00-07
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
PCI Express Applications
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.3
Systems Examples
10
Power Supply Recommendations
10.1
CDCUN1208LP Power Consumption
10.2
Device Power Supply Connections and Sequencing
10.3
Device Inputs (IN1, IN2)
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
接收文档更新通知
12.2
社区资源
12.3
商标
12.4
静电放电警告
12.5
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RHB|32
MPQF130D
散热焊盘机械数据 (封装 | 引脚)
RHB|32
QFND029X
订购信息
zhcs887d_oa
zhcs887d_pm
1
特性
支持 PCIe 1/2/3 代
配置选项(通过引脚或 SPI/I
2
C):
输入类型(高速电流驱动能力 (HCSL),低压差分信号 (LVDS),低压 COMS (LVCOMS))
输出类型 (HCSL,LVDS,LVCOMS)
信号边沿速率(慢、中、快)
时钟输入分配值 (/1, /2, /4, /8) - 只适用于 IN2
低功耗与电源管理 特性,包括 1.8V 运行和输出使能控制
具有集成稳压器,可改进 PSNR
卓越的附加抖动性能
LVDS 在 100MHz 时具有
200 fs RMS(10kHz 至 20MHz)
HCSL 在 100MHz 时具有
160 fs RMS(10kHz 至 20MHz)
最大工作频率:
差分模式:高达 400MHz
LVCOMS 模式:高达 250MHz
ESD 保护超过 2kV HBM、500V CDM
工业温度范围(–40°C 至 85°C)
宽电源范围(1.8V、2.5V 或者 3.3V)