ZHCS887D May 2012 – April 2019 CDCUN1208LP
PRODUCTION DATA.
THERMAL METRIC(1) | CDCUN1208LP | UNIT | |
---|---|---|---|
RHB Package | |||
32 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 32.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 6.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 6.6 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.6 | °C/W |