SBOS407D December   2007  – May 2016 VCA821

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: VS = ±5 V
    6. 7.6  Typical Characteristics: VS = ±5 V, DC Parameters
    7. 7.7  Typical Characteristics: VS = ±5 V, DC and Power-Supply Parameters
    8. 7.8  Typical Characteristics: VS = ±5 V, AVMAX = 6 dB
    9. 7.9  Typical Characteristics: VS = ±5 V, AVMAX = 20 dB
    10. 7.10 Typical Characteristics: VS = ±5 V, AVMAX = 32 dB
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Feature Description
    3. 9.3 Device Functional Modes
      1. 9.3.1 Maximum Gain of Operation
      2. 9.3.2 Output Current and Voltage
      3. 9.3.3 Input Voltage Dynamic Range
      4. 9.3.4 Output Voltage Dynamic Range
      5. 9.3.5 Bandwidth
      6. 9.3.6 Offset Adjustment
      7. 9.3.7 Noise
        1. 9.3.7.1 Input and ESD Protection
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Design-In Tools
        1. 10.1.1.1 Demonstration Boards
        2. 10.1.1.2 Macromodels and Applications Support
        3. 10.1.1.3 Operating Suggestions
        4. 10.1.1.4 Package Considerations
    2. 10.2 Typical Applications
      1. 10.2.1 Wideband Variable-Gain Amplifier Operation Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Difference Amplifier Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Differential Equalizer Application
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Differential Cable Equalizer Application
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedure
        3. 10.2.4.3 Application Curve
      5. 10.2.5 AGC Loop Application
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Detailed Design Procedure
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

E2E is a trademark of Texas Instruments.

X2Y is a registered trademark of X2Y Attenuators LLC.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.