ZHCSKG7 数据表 | 德州仪器 TI.com.cn

ZHCSKG7B June 2019 – February 2024 UCC5390-Q1

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DWV|8
- MPDS382B

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcskg7b_oa

5.12 Typical Characteristics

V_CC1 = 3.3 V or 5 V, 0.1-µF capacitor from V_CC1 to GND1, V_CC2= 15 V, 1-µF capacitor from V_CC2 to V_EE2, C_LOAD = 1 nF, T_J = –40°C to +125°C, (unless otherwise noted)

C_LOAD = 150 nF

Figure 5-3 Output-High Drive Current vs Output Voltage

IN+ = L

IN– = H

Figure 5-5 I_CC1 Supply Current vs Temperature

Duty Cycle = 50%

T = 25°C

Figure 5-7 I_CC1 Supply Current vs Input Frequency

IN+ = H

IN– = L

Figure 5-9 I_CC2 Supply Current vs Temperature

f_SW = 1 kHz

Figure 5-11 I_CC2 Supply Current vs Load Capacitance

Figure 5-13 Fall Time vs Temperature

Figure 5-15 Propagation Delay t_PHL vs Temperature

f_SW = 1 kHz

R_GH = 0 Ω

R_GL = 0 Ω

Figure 5-17 Fall Time vs Load Capacitance

C_LOAD = 150 nF

Figure 5-4 Output-Low Drive Current vs Output Voltage

IN+ = H

IN– = L

Figure 5-6 I_CC1 Supply Current vs Temperature

IN+ = L

IN– = H

Figure 5-8 I_CC2 Supply Current vs Temperature

Duty Cycle = 50%

T = 25°C

Figure 5-10 I_CC2 Supply Current vs Input Frequency

Figure 5-12 Rise Time vs Temperature

Figure 5-14 Propagation Delay t_PLH vs Temperature

f_SW = 1 kHz

R_GH = 0 Ω

R_GL = 0 Ω

Figure 5-16 Rise Time vs Load Capacitance