ZHCSTX9I September   2002  – November 2023 UCC27321 , UCC27322 , UCC37321 , UCC37322

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 说明（续）
  6. 5 Related Products
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Power Dissipation Ratings
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Source and Sink Capabilities during Miller Plateau
      4. 8.3.4 Enable
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input-to-Output Configuration
        2. 9.2.2.2 Input Threshold Type
        3. 9.2.2.3 VDD Bias Supply Voltage
        4. 9.2.2.4 Peak Source and Sink Currents
        5. 9.2.2.5 Enable and Disable Function
        6. 9.2.2.6 Propagation Delay
        7. 9.2.2.7 Power Dissipation
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
    1.     40
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • DGN|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 Revision History

Changes from Revision H (January 2016) to Revision I (November 2023)

  • 删除了“器件信息”表中的 P 封装Go
  • 删除了说明（续）部分中的 P 封装Go
  • Deleted P package from Pin Configuration and Functions sectionGo
  • Changed ESD Ratings from ±2500 V and ±1500 V to ±2000 V and ±1000 VGo
  • Changed input threshold voltage values, deleted VOH output high level and VOL output low level, changed output resistance high and output resistance low values and deleted Latch-up protection from Electrical Characteristics.Go
  • Deleted P package data from Power Dissipations Ratings sectionGo
  • Changed Figure 7-16 Go

Changes from Revision G (May 2013) to Revision H (January 2016)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go

Changes from Revision F (March 2012) to Revision G (May 2013)

  • Updated AGND pin description. Go
  • Changed minimum value for input voltage from –5 to –0.3 V in the Absolute Maximum Ratings table.Go
  • Added CLOAD = 10 nF to Fall Time vs Supply Voltage graphGo
  • Changed Changed x-axis values from 1, 10, 100 to 0.1, 1, 10 in Rise Time vs Load Capacitance graphGo
  • Changed Changed x-axis values from 1, 10, 100 to 0.1, 1, 10 in Fall Time vs Output Capacitance graphGo