ZHCSM92A January   2021  – June 2021 UCC12051-Q1


  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Disable
      2. 7.3.2 UVLO, Power-Up, and Power-Down Behavior
      3. 7.3.3 VISO Load Recommended Operating Area
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 External Clocking and Synchronization
      6. 7.3.6 VISO Output Voltage Selection
      7. 7.3.7 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. VISO Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information


机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

Layout Guidelines

The UCC12051-Q1 integrated isolated power solution simplifies system design and reduces board area usage. Proper PCB layout is important in order to achieve optimum performance. Here is a list of recommendations:

  1. Place decoupling capacitors as close as possible to the device pins. For the input supply, place the capacitor(s) between pin 3 (VINP) and pin 2 (GNDP). For the isolated output supply, place the capacitor(s) between pin 14 (VISO) and pin 15 (GNDS). This location is of particular importance to the input decoupling capacitor, because this capacitor supplies the transient current associated with the fast switching waveforms of the power drive circuits.
  2. Because the device does not have a thermal pad for heat-sinking, the device dissipates heat through the respective GND pins. Ensure that enough copper (preferably a connection to the ground plane) is present on all GNDP and GNDS pins for best heat-sinking.
  3. If space and layer count allow, it is also recommended to connect the VINP, GNDP, VISO and GNDS pins to internal ground or power planes through multiple vias of adequate size. Alternatively, make traces for these nets as wide as possible to minimize losses.
  4. TI also recommends grounding the no-connect pins (NC) to their respective ground planes. For pins 6, 7, and 8, connect to GNDP. For pins 10, 11, and 12, connect to GNDS. This will allow more continuous ground planes and larger thermal mass for heat-sinking.
  5. A minimum of four layers is recommended to accomplish a low-EMI PCB design. Inner layers can be spaced closer than outer layers and used to create a high-frequency bypass capacitor between GNDP and GNDS to reduce radiated emissions. Ensure proper spacing, both inter-layer and layer-to-layer, is implemented to avoid reducing isolation capabilities. These spacings will vary based on the printed circuit board construction parameters, such as dielectric material and thickness.
  6. Pay close attention to the spacing between primary ground plane (GNDP) and secondary ground plane (GNDS) on the PCB outer layers. The effective creepage and or clearance of the system will be reduced if the two ground planes have a lower spacing than that of the device package.
  7. To ensure isolation performance between the primary and secondary side, avoid placing any PCB traces or copper below the UCC12051-Q1 device on the outer copper layers.