ZHCSRT9E january   2007  – march 2023 TXB0101

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specification
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCCA = 1.2 V
    7. 6.7  Timing Requirements, VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements, VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements, VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements, VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 1.2 V
    12. 6.12 Switching Characteristics, VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Power Up
      3. 7.3.3 Enable and Disable
      4. 7.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Input Driver Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.1 Layout Guidelines

For device reliability, the following common printed-circuit board layout guidelines are recommended.

  • Bypass capacitors should be used on power supplies, and should be placed as close as possible to the VCCA, VCCB pin and GND pin.
  • Short trace lengths should be used to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one shot duration, approximately 10 ns, making sure that any reflection encounters low impedance at the source driver.