SCES639D January   2007  – March 2017 TXB0101

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specification
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCCA = 1.2 V
    7. 6.7  Timing Requirements, VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements, VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements, VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements, VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 1.2 V
    12. 6.12 Switching Characteristics, VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Power Up
      3. 8.3.3 Enable and Disable
      4. 8.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Input Driver Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Features

  • Available in the Texas Instruments NanoFree™ Package
  • 1.2 V to 3.6 V on A Port and
    1.65 V to 5.5 V on B Port (VCCA ≤ VCCB)
  • VCC Isolation Feature – If Either VCC Input is at GND, All Outputs are in the High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 5 μA Maximum ICC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • A Port
      • 2000 V Human Body Model (A114-B)
      • 250 V Machine Model (A115-A)
      • 1500 V Charged-Device Model (C101)
    • B Port
      • 15 kV Human Body Model (A114-B)
      • 250 V Machine Model (A115-A)
      • 1500 V Charged-Device Model (C101)

Applications

  • Handsets
  • Smartphones
  • Tablets
  • Desktop PCs

Description

This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB.

When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TXB0101DBV SOT-23 (6) 2.90 mm × 1.60 mm
TXB0101DCK SC70 (6) 2.00 mm × 1.25 mm
TXB0101DRL SOT (6) 1.60 mm × 1.20 mm
TXB0101YZP DSBGA (6) 1.1 mm × 1.20 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Operating Circuit

TXB0101 typ_circuit_ces639.gif