ZHCSHW9B March   2018  – October 2023 TUSB1002A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Control Inputs
      2. 7.3.2 Linear Equalization
      3. 7.3.3 Adjustable VOD Linear Range and DC Gain
      4. 7.3.4 USB3.2 Dual Channel Operation (MODE = “F”)
      5. 7.3.5 USB3.2 Single Channel Operation (MODE = “1”)
      6. 7.3.6 PCIe/SATA/SATA Express Redriver Operation (MODE = “R”; CFG1 = "0"; CFG2 = "0" )
      7. 7.3.7 Basic Redriver Operation (MODE = “0”)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Disconnect Mode
    5. 7.5 U0 Mode
    6. 7.6 U1 Mode
    7. 7.7 U2/U3 Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical USB3.2 Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 ESD Protection
      4. 8.2.4 Application Curves
    3. 8.3 Typical SATA, PCIe and SATA Express Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGE|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.1 Design Requirements

For this design example, use the parameters shown in Table 8-1.

Table 8-1 Design Parameters
PARAMETER VALUE
Pre-channel A to B PCB trace length(1), LAB. 1 inches ≤ LAB ≤ 12 inches - LCD
Post-channel C to D PCB trace length(1), LCD. ≤ 4 inches
Minimum distance of the AC capacitors from TUSB1002A, LAC-CAP 0.25 inches
Maximum distance of ESD component from the USB receptacle, LESD 0.6 inches
Maximum distance of series resistor (RESD) from ESD component, LR_ESD. 0.25 inches
CAC-USB1 AC-coupling capacitor (75 nF to 265 nF) 220 nF
CAC-USB2 AC-coupling capacitor (297 nF to 363 nF) Options:
  • RX1 and RX2 are DC-coupled to USB receptacle
  • 330 nF AC-couple with RRX resistor
Optional RRX resistor (220-kΩ ± 5%) No used
Optional RESD (0-Ω to 2.2-Ω) 1-Ω
VCC supply (3-V to 3.6-V) 3.3-V
Mode of Operation (Dual or Half Channel) MODE = F (Floating) for USB3.2 Dual Channel
Linear Range (900 mV, 1000 mV, or 1200 mV) 1200 mV (CFG[2:1] pins floating)
DC Gain (-2, -1, 0, +1, +2) 0 dB (CFG[2:1] pins floating)
(1) Maximum trace length assumes an insertion loss of 0.2 dB/inch/GHz. If insertion loss is more than 0.2 dB/inch/GHz, then maximum trace length must be reduced accordingly.